Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431403 | Semiconductor package including thermal interface material (TIM) layers on semiconductor chips | Kiwook Jung, Seunggeol Ryu, Sungeun JO | 2025-09-30 |
| 12388048 | Semiconductor package comprising heat spreader | Sungeun JO, Youngdeuk Kim, Taehwan Kim, Kyungsuk Oh | 2025-08-12 |
| 12243803 | Thermal interface material, method of manufacturing the same, and semiconductor packages including the same | Seunggeol Ryu, Seokkan Ki, Youngsuk Nam, Bangweon Lee, Seungtae Hwang | 2025-03-04 |
| 12237268 | Integrated circuit semiconductor device | Seunggeol Ryu, Kyungsuk Oh, Keungbeum Kim, Eonsoo Jang | 2025-02-25 |
| 12199002 | Semiconductor package and method of manufacturing the same | Taehwan Kim, Kyungsuk Oh | 2025-01-14 |
| 12009303 | Integrated circuit semiconductor device | Seunggeol Ryu, Kyungsuk Oh, Keungbeum Kim, Eonsoo Jang | 2024-06-11 |
| 11935812 | Thermal interface material and semiconductor packages including the same | Seunggeol Ryu, Seokkan Ki, Youngsuk Nam, Bangweon Lee, Seungtae Hwang | 2024-03-19 |
| 8988115 | Electronic device and method for controlling temperature thereof | SangWook Ju, Eunseok Cho | 2015-03-24 |