Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12243803 | Thermal interface material, method of manufacturing the same, and semiconductor packages including the same | Seunggeol Ryu, Seokkan Ki, Jaechoon Kim, Bangweon Lee, Seungtae Hwang | 2025-03-04 |
| 11935812 | Thermal interface material and semiconductor packages including the same | Seunggeol Ryu, Seokkan Ki, Jaechoon Kim, Bangweon Lee, Seungtae Hwang | 2024-03-19 |