| 12400970 |
Semiconductor package including electromagnetic shield structure |
Jongwan Kim, Kyonghwan Koh, Seunghwan KIM, Jungjoo Kim, Junwoo Park +1 more |
2025-08-26 |
| 12308253 |
Molded product for semiconductor strip and method of manufacturing semiconductor package |
Seunghwan KIM, Kyonghwan Koh, Jungjoo Kim, Jongwan Kim, Junwoo Park +3 more |
2025-05-20 |
| 12288743 |
Semiconductor package |
Junwoo Park, Seunghwan KIM, Jungjoo Kim, Dongju Jang |
2025-04-29 |
| 12205925 |
Semiconductor package having package substrate |
Seunghwan KIM, Jungjoo Kim, Jongwan Kim, Hyunki Kim, Junwoo Park +3 more |
2025-01-21 |
| 12132007 |
Semiconductor package |
Jongwan Kim, Kyong Hwan Koh, Juhyeon Oh |
2024-10-29 |
| 12087650 |
Interposer and semiconductor package including the same |
Junyoung Oh, Hyunggil Baek, Seunghwan KIM, Jungjoo Kim, Jongho Park |
2024-09-10 |
| 12057357 |
Semiconductor package including plurality of recesses and molding member with plurality of protrusions that fill the recesses |
Kyong Hwan Koh, Jongwan Kim, Juhyeon Oh |
2024-08-06 |
| 11742294 |
Interposers and semiconductor packages including the same |
Jongho Park, Seunghwan KIM, Junyoung Oh, Yonghyun KIM, Junga Lee |
2023-08-29 |
| 11742329 |
Semiconductor package |
Jongho Park, Kyungsuk Oh, Hyunki Kim, Sangsoo Kim, Seungkon Mok +2 more |
2023-08-29 |
| 11728142 |
Apparatus for conducting plasma surface treatment, board treatment system having the same |
Junyoung Oh, Jaeho Kwak, Boeun Jang, Seokyeon Hwang, Yongseok Seo +7 more |
2023-08-15 |
| 11710673 |
Interposer and semiconductor package including the same |
Choongbin Yim, Dongwook Kim, Hyunki Kim, Jongbo Shim, Jihwang Kim +2 more |
2023-07-25 |
| 11688656 |
Interposer and semiconductor package including the same |
Junyoung Oh, Hyunggil Baek, Seunghwan KIM, Jungjoo Kim, Jongho Park |
2023-06-27 |
| 11581266 |
Semiconductor package |
Jongwan Kim, Kyong Hwan Koh, Juhyeon Oh |
2023-02-14 |
| 11538801 |
Semiconductor package |
Jongho Park, Seung Hwan Kim, Jun Young Oh, Jungjoo Kim, Dong-Ju Jang |
2022-12-27 |
| 11508713 |
Methods of manufacturing semiconductor package and package-on-package |
Junyoung Oh, Kyonghwan Koh, Sangsoo Kim, Seunghwan KIM, Jongho Park |
2022-11-22 |
| 11469156 |
Semiconductor package for discharging heat generated by semiconductor chip |
Hyunki Kim, Sangsoo Kim, Seung Hwan Kim, Kyung Suk Oh, Jongho Lee |
2022-10-11 |
| 11101243 |
Semiconductor package |
Jongho Park, Kyungsuk Oh, Hyunki Kim, Sangsoo Kim, Seungkon Mok +2 more |
2021-08-24 |
| 10978374 |
Semiconductor package for discharging heat generated by semiconductor chip |
Hyunki Kim, Sangsoo Kim, Seung Hwan Kim, Kyung Suk Oh, Jongho Lee |
2021-04-13 |
| 10008488 |
Semiconductor module adapted to be inserted into connector of external device |
Kundae Yeom, Jongho Lee, Hogeon Song |
2018-06-26 |
| 9894745 |
Antenna structure and plasma generating device |
— |
2018-02-13 |
