Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12400970 | Semiconductor package including electromagnetic shield structure | Jongwan Kim, Yongkwan Lee, Seunghwan KIM, Jungjoo Kim, Junwoo Park +1 more | 2025-08-26 |
| 12308253 | Molded product for semiconductor strip and method of manufacturing semiconductor package | Seunghwan KIM, Jungjoo Kim, Jongwan Kim, Junwoo Park, Hyunggil Baek +3 more | 2025-05-20 |
| 11508713 | Methods of manufacturing semiconductor package and package-on-package | Junyoung Oh, Sangsoo Kim, Seunghwan KIM, Jongho Park, Yongkwan Lee | 2022-11-22 |