Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12308253 | Molded product for semiconductor strip and method of manufacturing semiconductor package | Seunghwan KIM, Kyonghwan Koh, Jungjoo Kim, Jongwan Kim, Junwoo Park +3 more | 2025-05-20 |
| 12208541 | Dicing blade including diamond particles | Youngja Kim, Younhwan SHIN | 2025-01-28 |
| 12205925 | Semiconductor package having package substrate | Yongkwan Lee, Seunghwan KIM, Jungjoo Kim, Jongwan Kim, Hyunki Kim +3 more | 2025-01-21 |
| 12087650 | Interposer and semiconductor package including the same | Junyoung Oh, Seunghwan KIM, Jungjoo Kim, Jongho Park, Yongkwan Lee | 2024-09-10 |
| 11688656 | Interposer and semiconductor package including the same | Junyoung Oh, Seunghwan KIM, Jungjoo Kim, Jongho Park, Yongkwan Lee | 2023-06-27 |
| 10916509 | Substrate, method of sawing substrate, and semiconductor device | Yun-Rae Cho, Sundae KIM, Namgyu Baek, Seunghun Shin, Donghoon Won | 2021-02-09 |
| 10872875 | Bonding head and method for bonding semiconductor package, and semiconductor package | Sanghoon Lee, Jiwon Shin, Minkeun Kwak, Jongho Lee | 2020-12-22 |
| 10418335 | Substrate, method of sawing substrate, and semiconductor device | Yun-Rae Cho, Sundae KIM, Namgyu Baek, Seunghun Shin, Donghoon Won | 2019-09-17 |
| 8218346 | Multi-chip packages including extra memory chips to define additional logical packages and related devices | — | 2012-07-10 |