Issued Patents All Time
Showing 1–25 of 116 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12395173 | Integrated circuit that applies different data interface terminations during and after write data reception | Ian Shaeffer | 2025-08-19 |
| 12308363 | Semiconductor package | Manho Lee, Eunseok Song, Keung Beum Kim, Eon Soo Jang | 2025-05-20 |
| 12249399 | On-die termination of address and command signals | Ian Shaeffer | 2025-03-11 |
| 12232246 | Structure for delivering power | Ralf M. Schmitt, Yijong Feng | 2025-02-18 |
| 12218070 | Semiconductor package and method of fabricating the same | Hae-Jung Yu | 2025-02-04 |
| 12166010 | Semiconductor package and method of manufacturing the same | Eunseok Song | 2024-12-10 |
| 12142544 | Semiconductor package | Taehwan Kim, Young-Deuk Kim, Jae Choon Kim, Eungchang Lee | 2024-11-12 |
| 12142348 | Memory device comprising programmable command-and-address and/or data interfaces | Ian Shaeffer, Lawrence Lai, Fan Ho, David A. Secker, Wayne S. Richardson +2 more | 2024-11-12 |
| 12125766 | Thermoelectric cooling packages | Tae Hwan Kim, Jae Choon Kim | 2024-10-22 |
| 12040304 | Semiconductor package and method of fabricating the same | Eunseok Song | 2024-07-16 |
| 12002540 | On-die termination of address and command signals | Ian Shaeffer | 2024-06-04 |
| 11887965 | Semiconductor package | Eunseok Song | 2024-01-30 |
| 11882647 | Structure for delivering power | Ralf M. Schmitt, Yijiong Feng | 2024-01-23 |
| 11862618 | Semiconductor package | Manho Lee, Eunseok Song, Keung Beum Kim, Eon Soo Jang | 2024-01-02 |
| 11848308 | Semiconductor package | Wansoo Park, Sang-Sub Song | 2023-12-19 |
| 11837577 | System-in-package module | Ae-Nee Jang, Eunseok Song, Seung-Yong Cha | 2023-12-05 |
| 11783879 | Memory device comprising programmable command-and-address and/or data interfaces | Ian Shaeffer, Lawrence Lai, Fan Ho, David A. Secker, Wayne S. Richardson +2 more | 2023-10-10 |
| 11756850 | Chip on film package and display device including the same | Seung-Tae Hwang, Jae Choon Kim, Woon-bae Kim, Jae-Min Jung | 2023-09-12 |
| 11688441 | On-die termination of address and command signals | Ian Shaeffer | 2023-06-27 |
| 11664348 | Substrate assembly semiconductor package including the same and method of manufacturing 1HE semiconductor package | Do Hyun Kim, Sunwon Kang | 2023-05-30 |
| 11637070 | Method of fabricating a semiconductor package | Hae-Jung Yu | 2023-04-25 |
| 11532591 | Semiconductor package and method of fabricating the same | Eunseok Song | 2022-12-20 |
| 11495576 | Semiconductor package | Kyoungsoo Kim, Sunwon Kang, Seungduk Baek, Ho-Geon Song | 2022-11-08 |
| 11482509 | Semiconductor package | Se-Ho You, Sunkyoung Seo | 2022-10-25 |
| 11469156 | Semiconductor package for discharging heat generated by semiconductor chip | Hyunki Kim, Sangsoo Kim, Seung Hwan Kim, Yongkwan Lee, Jongho Lee | 2022-10-11 |