Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12420348 | Solder reflow apparatus and method of manufacturing electronic device | Youngja Kim | 2025-09-23 |
| 12165974 | Semiconductor package | Won Young Kim | 2024-12-10 |
| 12009342 | Semiconductor packages | Hyoungjoon Kim | 2024-06-11 |
| 11848255 | Semiconductor package structure on a PCB and semiconductor module including the same | YoungJoon Lee | 2023-12-19 |
| 11769746 | Semiconductor package | Ae-Nee Jang, Kyungseon Hwang | 2023-09-26 |
| 11664348 | Substrate assembly semiconductor package including the same and method of manufacturing 1HE semiconductor package | Kyung Suk Oh, Do Hyun Kim | 2023-05-30 |
| 11495576 | Semiconductor package | Kyoungsoo Kim, Seungduk Baek, Ho-Geon Song, Kyung Suk Oh | 2022-11-08 |
| 11257723 | Inspection system and method for inspecting semiconductor package, and method of fabricating semiconductor package | Do Hyun Kim, Hogeon Song, Kyung Suk Oh | 2022-02-22 |
| 11018121 | Semiconductor packages | Sangnam JEONG, IlJoon Kim | 2021-05-25 |
| 10985138 | Semiconductor package having a plurality of chips and method of manufacturing the same | Won Young Kim | 2021-04-20 |
| 10943881 | Semiconductor package | Ae-Nee Jang, Kyungseon Hwang | 2021-03-09 |
| 10861826 | Substrate assembly semiconductor package including the same and method of manufacturing the semiconductor package | Kyung Suk Oh, Do Hyun Kim | 2020-12-08 |
| 10797030 | Semiconductor packages | Sangnam JEONG, IlJoon Kim | 2020-10-06 |
| 10720382 | Semiconductor package structure and semiconductor module including the same | YoungJoon Lee | 2020-07-21 |
| 10720408 | High-speed semiconductor modules | Kyoungsoo Kim | 2020-07-21 |
| 10522506 | High-speed semiconductor modules | Kyoungsoo Kim | 2019-12-31 |
| 10211176 | Semiconductor package | Ae-Nee Jang, Kyungseon Hwang | 2019-02-19 |
| 9633973 | Semiconductor package | Kilsoo Kim | 2017-04-25 |
| 8981574 | Semiconductor package | Kilsoo Kim | 2015-03-17 |
| 8933747 | Semiconductor chip package including voltage generation circuit with reduced power noise | Chiwook Kim, Hyun jeong Woo, Sangjoon Hwang | 2015-01-13 |
| 8823172 | Semiconductor package and method for fabricating the same | Hwan-Sik Lim, Jongho Lee | 2014-09-02 |
| 8680685 | Semiconductor package and method for fabricating the same | Hwan-Sik Lim, Jongho Lee | 2014-03-25 |