Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11257723 | Inspection system and method for inspecting semiconductor package, and method of fabricating semiconductor package | Do Hyun Kim, Sunwon Kang, Kyung Suk Oh | 2022-02-22 |
| 10008488 | Semiconductor module adapted to be inserted into connector of external device | Yongkwan Lee, Kundae Yeom, Jongho Lee | 2018-06-26 |
| 9793165 | Methods of fabricating semiconductor devices | SeYoung Jeong, Taeje Cho, Kyu-Ha Lee | 2017-10-17 |
| 9202716 | Methods of fabricating fan-out wafer level packages and packages formed by the methods | Jin-Woo Park, Seokhyun Lee | 2015-12-01 |
| 8933561 | Semiconductor device for semiconductor package having through silicon vias of different heights | SeYoung Jeong, Chungsun Lee, Ho-Jin Lee | 2015-01-13 |
| 8766455 | Stacked semiconductor devices and fabrication methods thereof | SeYoung Jeong, Sunpil Youn | 2014-07-01 |