| 12237319 |
Stacked-chip packages |
Daeho Lee |
2025-02-25 |
| 11923351 |
Stacked-chip packages having through vias |
Daeho Lee |
2024-03-05 |
| 10734367 |
Semiconductor package and method of fabricating the same |
Seung-Kwan Ryu, Yonghwan Kwon, Yun-Seok Choi, Chajea Jo |
2020-08-04 |
| 10192855 |
Semiconductor package and electronic device having heat dissipation pattern and/or heat conducting line |
Sunkyoung Seo, Chajea Jo, Ji Hwang Kim |
2019-01-29 |
| 10186500 |
Semiconductor package and method of fabricating the same |
Seung-Kwan Ryu, Yonghwan Kwon, Yun-Seok Choi, Chajea Jo |
2019-01-22 |
| 10157766 |
Method of fabricating a semiconductor device |
Un-Byoung Kang, Joonsik Sohn, Jung-Seok Ahn, Chungsun Lee |
2018-12-18 |
| 10121731 |
Semiconductor device |
Sang Cheon Park, Won-Il Lee, Chajea Jo |
2018-11-06 |
| 9905550 |
Semiconductor package and method of fabricating the same |
Sang-Uk Han, Seungwon Park, Un-Byoung Kang |
2018-02-27 |
| 9875992 |
Semiconductor package having stacked chips and a heat dissipation part and method of fabricating the same |
Junyeong Heo, Chajea Jo |
2018-01-23 |
| 9793165 |
Methods of fabricating semiconductor devices |
SeYoung Jeong, Hogeon Song, Kyu-Ha Lee |
2017-10-17 |
| 9646895 |
Semiconductor package and manufacturing method thereof |
Seungduk Baek, Ji Hwang Kim |
2017-05-09 |
| 9508704 |
Method of fabricating semiconductor package, semiconductor package formed thereby, and semiconductor device including the same |
Hyunsoo Chung, Inyoung Lee |
2016-11-29 |
| 9461029 |
Semiconductor packages and methods for fabricating the same |
Hye-Young Jang, Chang-Seong Jeon, Chajea Jo |
2016-10-04 |
| 9355961 |
Semiconductor devices having through-electrodes and methods for fabricating the same |
Chajea Jo, Hyunsoo Chung |
2016-05-31 |
| 9275903 |
Method of manufacturing semiconductor device substrate with crystal structure reformation regions |
Byoung-Soo Kwak, Youngsu Kim, Sangwook Park |
2016-03-01 |
| 9245771 |
Semiconductor packages having through electrodes and methods for fabricating the same |
Hyunsoo Chung, Keum-Hee Ma, In-Young Lee, Moon Gi Cho, Chajea Jo |
2016-01-26 |
| 9177942 |
Semiconductor package and method of fabricating the same |
Wonkeun Kim, In-Young Lee, Chang-Seong Jeon |
2015-11-03 |
| 9024434 |
Semiconductor packages |
Yunhyeok Im, Kyol Park |
2015-05-05 |
| 8884416 |
Semiconductor apparatus having through vias configured to isolate power supplied to a memory chip from data signals supplied to the memory chip |
Go-Eun Lee, Un-Byoung Kang, Seongmin Ryu, Jung-Hwan Kim, Tae Hong Min |
2014-11-11 |
| 8802495 |
Semiconductor packages, methods of manufacturing the same, and semiconductor package structures including the same |
Ji Hwang Kim, Tae Hong Min, Chajea Jo, Young Kun Jee, Yun-Seok Choi |
2014-08-12 |
| 8558371 |
Method for wafer level package and semiconductor device fabricated using the same |
JiSun Hong, Un-Byoung Kang, Hyuekjae Lee, Youngbok Kim, Hyung-Sun Jang |
2013-10-15 |
| 8399987 |
Microelectronic devices including conductive vias, conductive caps and variable thickness insulating layers |
Woonseong Kwon, Hyuekjae Lee, Yonghwan Kwon, Jung-Hwan Kim, Chiyoung Lee +1 more |
2013-03-19 |
