Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10930648 | Semiconductor devices having multi-level metallization structures | Hyeonuk Kim, Jongchan Shin, Eryung Hwang, Jaeseok Yang, Jinwoo Jeong | 2021-02-23 |
| 10770384 | Printed circuit board having insulating metal oxide layer covering connection pad | Soo-Jae Park | 2020-09-08 |
| 10636785 | Semiconductor device | Hwichan Jun, Deokhan Bae, Heonjong Shin, Jaeran Jang, YoungWoo Cho | 2020-04-28 |
| 10518382 | Substrate processing system | Young Kyu Kweon, Byoung Chaul Son, Joon Ho An | 2019-12-31 |
| 10453838 | Semiconductor device | Hwichan Jun, Deokhan Bae, Heonjong Shin, Jaeran Jang, YoungWoo Cho | 2019-10-22 |
| 10347627 | Semiconductor devices | Hyeonuk Kim, Jongchan Shin, Eryung Hwang, Jaeseok Yang, Jinwoo Jeong | 2019-07-09 |
| 10211089 | Semiconductor device and method of fabricating the same | Byungju Kang, Janie Hyojin Kim | 2019-02-19 |
| 9704729 | Substrate cleaning apparatus and method and brush assembly used therein | Jun Ho Son | 2017-07-11 |
| 9449918 | Semiconductor device having fuse pattern | Eun-Chul Ahn, Sang-Young Kim, Joo-Weon Shin, Min Ho Lee | 2016-09-20 |
| 9312213 | Bump structures having an extension | Young Lyong Kim, Sun-Hee Park, Hwan-Sik Lim | 2016-04-12 |
| 9245771 | Semiconductor packages having through electrodes and methods for fabricating the same | Hyunsoo Chung, Keum-Hee Ma, In-Young Lee, Chajea Jo, Taeje Cho | 2016-01-26 |
| 9123725 | Semiconductor device having fuse pattern | Eun-Chul Ahn, Sang-Young Kim, Joo-Weon Shin, Min Ho Lee | 2015-09-01 |
| 8980739 | Solder collapse free bumping process of semiconductor device | Sang-Hee Lee, Jeong Woo Park | 2015-03-17 |
| 8928150 | Multi-chip package and method of manufacturing the same | Sun-Hee Park, Hwan-Sik Lim, Yong-Hwan Kwon | 2015-01-06 |
| 8922008 | Bump structure, having concave lateral sides, semiconductor package having the bump structure, and method of forming the bump structure | Jong-Yun Myung, Yong-Hwan Kwon, Jong Bo Shim | 2014-12-30 |
| 8710657 | Semiconductor assembly and semiconductor package including a solder channel | Jeong Woo Park, Ui-Hyoung Lee, Sun-Hee Park | 2014-04-29 |