Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9159688 | Semiconductor device including a solder and method of fabricating the same | Yonghwan Kwon | 2015-10-13 |
| 8922008 | Bump structure, having concave lateral sides, semiconductor package having the bump structure, and method of forming the bump structure | Yong-Hwan Kwon, Jong Bo Shim, Moon Gi Cho | 2014-12-30 |
| 8563349 | Method of forming semiconductor device | Hyuek Jae Lee, Ji-Sun Hong, Tae-Je Cho, Un-Byoung Kang, Hyung-Sun Jang +3 more | 2013-10-22 |
| 8304288 | Methods of packaging semiconductor devices including bridge patterns | Hyuek Jae Lee, Ji-Sun Hong, Tae-Je Cho, Young Bok Kim, Hyung-Sun Jang +1 more | 2012-11-06 |