Issued Patents All Time
Showing 25 most recent of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12300665 | Semiconductor package | Jang-woo Lee, Un-Byoung Kang, Ji Hwang Kim, Young Kun Jee | 2025-05-13 |
| 12283578 | Semiconductor package and method of fabricating same | Jeong Hyun Lee, Hwan Pil Park | 2025-04-22 |
| 12113087 | Image sensor package | Ji Hwang Kim, Sang-Uk Han, Cha-Jea Jo, Won-Il Lee | 2024-10-08 |
| 12057366 | Semiconductor devices including a lower semiconductor package, an upper semiconductor package on the lower semiconductor package, and a connection pattern between the lower semiconductor package and the upper semiconductor package | Ji Hwang Kim, Jang-woo Lee, Yung-Cheol Kong, Young Hoon Hyun | 2024-08-06 |
| 11908806 | Semiconductor package and method of fabricating the same | Dong Ho Kim, Ji Hwang Kim, Hwan Pil Park | 2024-02-20 |
| 11637140 | Image sensor package | Ji Hwang Kim, Sang-Uk Han, Cha-Jea Jo, Won-Il Lee | 2023-04-25 |
| 11600545 | Semiconductor devices including a lower semiconductor package, an upper semiconductor package on the lower semiconductor package, and a connection pattern between the lower semiconductor package and the upper semiconductor package | Ji Hwang Kim, Jang-woo Lee, Yung-Cheol Kong, Young Hoon Hyun | 2023-03-07 |
| 11227855 | Semiconductor package | Jang-woo Lee, Un-Byoung Kang, Ji Hwang Kim, Young Kun Jee | 2022-01-18 |
| 11069592 | Semiconductor packages including a lower structure, an upper structure on the lower structure, and a connection pattern between the lower structure and the upper structure | Ji Hwang Kim, Jang-woo Lee, Yung-Cheol Kong, Young Hoon Hyun | 2021-07-20 |
| 10971535 | Image sensor package | Ji Hwang Kim, Sang-Uk Han, Cha-Jea Jo, Won-Il Lee | 2021-04-06 |
| 10964618 | Semiconductor package and method of manufacturing the same | Jang-woo Lee, Kyung Suk Oh, Yung-Cheol Kong, Woo Hyun Park, Jae-myeong Cha | 2021-03-30 |
| 10750112 | Substrate structures for image sensor modules and image sensor modules including the same | Ji Hwang Kim, Hyo-Eun Kim, Cha-Jea Jo, Sang-Uk Han | 2020-08-18 |
| 10680025 | Semiconductor package and image sensor | Cha-Jea Jo, Sang-Uk Han | 2020-06-09 |
| 10224272 | Semiconductor package including a rewiring layer with an embedded chip | Ji Hwang Kim, Cha-Jea Jo, Won-Il Lee | 2019-03-05 |
| 10199319 | Printed circuit board and semiconductor package including the same | Sang-Uk Han, Yun-Seok Choi, Ji Hwang Kim | 2019-02-05 |
| 10026724 | Semiconductor package and method of manufacturing the same | Ji Hwang Kim, Sang-Uk Han, Cha-Jea Jo, Gun-ho Chang | 2018-07-17 |
| 9997446 | Semiconductor package including a rewiring layer with an embedded chip | Ji Hwang Kim, Cha-Jea Jo, Won-Il Lee | 2018-06-12 |
| 9966364 | Semiconductor package and method for fabricating the same | Gun-ho Chang, Cha-Je Jo | 2018-05-08 |
| 9899337 | Semiconductor package and manufacturing method thereof | Gun-ho Chang, Tae-Je Cho | 2018-02-20 |
| 9230876 | Stack type semiconductor package | Jang-woo Lee, Kyoung-Sei Choi | 2016-01-05 |
| 8922008 | Bump structure, having concave lateral sides, semiconductor package having the bump structure, and method of forming the bump structure | Jong-Yun Myung, Yong-Hwan Kwon, Moon Gi Cho | 2014-12-30 |
| 8829686 | Package-on-package assembly including adhesive containment element | Ji-Sun Hong, Young Min Kim, Jung Woo Kim, Min-Ok Na, Hyo-Chang Ryu | 2014-09-09 |
| 7304371 | Lead frame having a lead with a non-uniform width | Tae Hun Kim, Tae-Je Cho | 2007-12-04 |
| 7211889 | Semiconductor package and method for manufacturing the same | — | 2007-05-01 |
| 7161249 | Multi-chip package (MCP) with spacer | Han Seob Hyun | 2007-01-09 |