Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12057366 | Semiconductor devices including a lower semiconductor package, an upper semiconductor package on the lower semiconductor package, and a connection pattern between the lower semiconductor package and the upper semiconductor package | Ji Hwang Kim, Jong Bo Shim, Jang-woo Lee, Yung-Cheol Kong | 2024-08-06 |
| 11600545 | Semiconductor devices including a lower semiconductor package, an upper semiconductor package on the lower semiconductor package, and a connection pattern between the lower semiconductor package and the upper semiconductor package | Ji Hwang Kim, Jong Bo Shim, Jang-woo Lee, Yung-Cheol Kong | 2023-03-07 |
| 11069592 | Semiconductor packages including a lower structure, an upper structure on the lower structure, and a connection pattern between the lower structure and the upper structure | Ji Hwang Kim, Jong Bo Shim, Jang-woo Lee, Yung-Cheol Kong | 2021-07-20 |