Issued Patents All Time
Showing 1–25 of 44 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12300665 | Semiconductor package | Jang-woo Lee, Un-Byoung Kang, Jong Bo Shim, Young Kun Jee | 2025-05-13 |
| 12113087 | Image sensor package | Jong Bo Shim, Sang-Uk Han, Cha-Jea Jo, Won-Il Lee | 2024-10-08 |
| 12062605 | Semiconductor package including an interposer and method of fabricating the same | Hyunkyu Kim, Jongbo Shim, Eunhee Jung, Kyoungsei Choi | 2024-08-13 |
| 12057366 | Semiconductor devices including a lower semiconductor package, an upper semiconductor package on the lower semiconductor package, and a connection pattern between the lower semiconductor package and the upper semiconductor package | Jong Bo Shim, Jang-woo Lee, Yung-Cheol Kong, Young Hoon Hyun | 2024-08-06 |
| 11908806 | Semiconductor package and method of fabricating the same | Dong Ho Kim, Hwan Pil Park, Jong Bo Shim | 2024-02-20 |
| 11876083 | Semiconductor package | Dongho Kim, Hwan Pil Park, Jongbo Shim | 2024-01-16 |
| 11728230 | Semiconductor package and method of fabricating the same | Dongho Kim, Jin-Woo Park, Jongbo Shim | 2023-08-15 |
| 11658107 | Semiconductor package including an interposer and method of fabricating the same | Hyunkyu Kim, Jongbo Shim, Eunhee Jung, Kyoungsei Choi | 2023-05-23 |
| 11637140 | Image sensor package | Jong Bo Shim, Sang-Uk Han, Cha-Jea Jo, Won-Il Lee | 2023-04-25 |
| 11600545 | Semiconductor devices including a lower semiconductor package, an upper semiconductor package on the lower semiconductor package, and a connection pattern between the lower semiconductor package and the upper semiconductor package | Jong Bo Shim, Jang-woo Lee, Yung-Cheol Kong, Young Hoon Hyun | 2023-03-07 |
| 11569201 | Semiconductor package and method of fabricating the same | Hyoeun Kim, Jisun YANG, Seunghoon Yeon, Chajea Jo, Sang-Uk Han | 2023-01-31 |
| 11367679 | Semiconductor package including an in interposer and method of fabricating the same | Hyunkyu Kim, Jongbo Shim, Eunhee Jung, Kyoungsei Choi | 2022-06-21 |
| 11367714 | Semiconductor package device | Jangwoo Lee, Jongbo Shim, Yungcheol Kong, Youngbae Kim, Taehwan Kim +1 more | 2022-06-21 |
| 11227855 | Semiconductor package | Jang-woo Lee, Un-Byoung Kang, Jong Bo Shim, Young Kun Jee | 2022-01-18 |
| 11158603 | Semiconductor package and method of fabricating the same | Hyoeun Kim, Jisun YANG, Seunghoon Yeon, Chajea Jo, Sang-Uk Han | 2021-10-26 |
| 11152416 | Semiconductor package including a redistribution line | Chajea Jo, Hyoeun Kim, Jongbo Shim, Sang-Uk Han | 2021-10-19 |
| 11069592 | Semiconductor packages including a lower structure, an upper structure on the lower structure, and a connection pattern between the lower structure and the upper structure | Jong Bo Shim, Jang-woo Lee, Yung-Cheol Kong, Young Hoon Hyun | 2021-07-20 |
| 11018173 | Image sensor | Kyung Suk Oh | 2021-05-25 |
| 10978431 | Semiconductor package with connection substrate and method of manufacturing the same | Jongbo Shim, Chajea Jo, Sang-Uk Han | 2021-04-13 |
| 10971535 | Image sensor package | Jong Bo Shim, Sang-Uk Han, Cha-Jea Jo, Won-Il Lee | 2021-04-06 |
| 10923428 | Semiconductor package having second pad electrically connected through the interposer chip to the first pad | Kilsoo Kim, Jongbo Shim, Jangwoo Lee, Eunhee Jung | 2021-02-16 |
| 10750112 | Substrate structures for image sensor modules and image sensor modules including the same | Hyo-Eun Kim, Jong Bo Shim, Cha-Jea Jo, Sang-Uk Han | 2020-08-18 |
| 10685921 | Semiconductor chip module including a channel for controlling warpage and method of manufacturing the same | Young Kun Jee, Un-Byoung Kang | 2020-06-16 |
| 10651224 | Semiconductor package including a redistribution line | Chajea Jo, Hyoeun Kim, Jongbo Shim, Sang-Uk Han | 2020-05-12 |
| 10361170 | Semiconductor package | Sungeun Pyo, Jongbo Shim, Chajea Jo, Sang-Uk Han | 2019-07-23 |