Issued Patents All Time
Showing 25 most recent of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12119288 | Semiconductor package | Sungwoo Park | 2024-10-15 |
| 11776866 | Semiconductor module heatspreading lid having integrated separators for multiple chips | Shle-Ge Lee, Ae-Nee Jang | 2023-10-03 |
| 11527470 | Film package and method of fabricating package module | Shle-Ge Lee, Ji-Yong Park | 2022-12-13 |
| 11367714 | Semiconductor package device | Jangwoo Lee, Jongbo Shim, Ji Hwang Kim, Yungcheol Kong, Taehwan Kim +1 more | 2022-06-21 |
| 11140772 | Printed circuit board including warpage offset regions and semiconductor packages including the same | Shle-Ge Lee | 2021-10-05 |
| 10985213 | Nonvolatile memory device | Si-Ho Song, Dueung Kim, Changhyun Cho | 2021-04-20 |
| 10971548 | Variable resistance memory device including symmetrical memory cell arrangements and method of forming the same | Sung-ho Eun, Daehwan Kang, Sungwon Kim, Seokjae Won | 2021-04-06 |
| 10720211 | Semiconductor devices | Sungwoo Kim, Bong-Soo Kim, Kijae Hur, Gwanhyeob Koh, HyeongSun Hong +1 more | 2020-07-21 |
| 10699056 | Computer-implemented method, processor-implemented system, and non-transitory computer-readable storage medium storing instructions for simulation of printed circuit board | Kyungsuk Oh | 2020-06-30 |
| 10580469 | Semiconductor devices | Sungwoo Kim, Bong-Soo Kim, Kijae Hur, Gwanhyeob Koh, HyeongSun Hong +1 more | 2020-03-03 |
| 10506706 | Printed circuit board including warpage offset regions and semiconductor packages including the same | Shle-Ge Lee | 2019-12-10 |
| 10446560 | Semiconductor devices | Sungwoo Kim, Bong-Soo Kim, Kijae Hur, Gwanhyeob Koh, HyeongSun Hong +1 more | 2019-10-15 |
| 10410722 | Semiconductor devices | Sungwoo Kim, Bong-Soo Kim, Kijae Hur, Gwanhyeob Koh, HyeongSun Hong +1 more | 2019-09-10 |
| 10395706 | Semiconductor devices | Sungwoo Kim, Bong-Soo Kim, Kijae Hur, Gwanhyeob Koh, HyeongSun Hong +1 more | 2019-08-27 |
| 10043789 | Semiconductor packages including an adhesive pattern | — | 2018-08-07 |
| 9978661 | Packaged semiconductor chips having heat dissipation layers and ground contacts therein | Yunhyeok Im, Oleg Feygenson, Sang-Il Kim, Jichul Kim, Seungkon Mok +1 more | 2018-05-22 |
| 9741668 | Semiconductor packages having residual stress layers and methods of fabricating the same | — | 2017-08-22 |
| 9731492 | Substrate peeling apparatus and method of peeling substrate using the same | Kwangho Lee, Sangil Kim, Jongseong Kim, Hyeokyun Kwon | 2017-08-15 |
| 9552879 | Nonvolatile memory device having variable resistance memory cells and a method of resetting by initially performing pre-read or strong set operation | Yongkyu Lee, Yeongtaek Lee | 2017-01-24 |
| 9530741 | Semiconductor packages having residual stress layers and methods of fabricating the same | — | 2016-12-27 |
| 9514807 | Variable resistance memory device | YounSeon Kang, Jungdal Choi, Masayuki Terai, Jung Moo Lee, Seungjae Jung | 2016-12-06 |
| 9500890 | Method of manufacturing device substrate and display device manufactured using the same | Taehwan Kim, Myeonghee Kim, Jong-Seong Kim, Myunghwan Park, Jonghwan Lee | 2016-11-22 |
| 9401401 | Semiconductor device | Francois Hebert, I-Shan Sun, Youngju Kim, Kwangil Kim, Intaek OH +1 more | 2016-07-26 |
| 8986805 | Vacuum insulation panel, refrigerator with vacuum insulation panel and manufacturing method for vacuum insulation panel | Ilseob Yoon, Jaehyun Soh | 2015-03-24 |
| 8951622 | Vacuum insulation member, registrator having vacuum insulation member, and method for fabricating vacuum insulation member | Minkyu Hwang, Dongju Jung, Ilseob Yoon, Jinwoo Shim, Kyungdo Kim | 2015-02-10 |