Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11482554 | Semiconductor package and method of fabricating the same | Un-Byoung Kang, Hyunsu Jun, Kyoungsei Choi | 2022-10-25 |
| 11367714 | Semiconductor package device | Jangwoo Lee, Jongbo Shim, Ji Hwang Kim, Youngbae Kim, Taehwan Kim +1 more | 2022-06-21 |
| 10868073 | Method of fabricating semiconductor package | Un-Byoung Kang, Hyunsu Jun, Kyoungsei Choi | 2020-12-15 |
| 10756055 | Stacked image sensor package and stacked image sensor module including the same | Un-Byoung Kang, Kyoungsei Choi | 2020-08-25 |
| 10262971 | Stacked image sensor package and stacked image sensor module including the same | Un-Byoung Kang, Kyoungsei Choi | 2019-04-16 |
| 10177188 | Semiconductor package and method of fabricating the same | Un-Byoung Kang, Hyunsu Jun, Kyoungsei Choi | 2019-01-08 |
| 9883593 | Semiconductor modules and semiconductor packages | KyongSoon Cho | 2018-01-30 |