Issued Patents All Time
Showing 25 most recent of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12388029 | Semiconductor package | Choongbin Yim, Jihwang Kim, Jinwoo Park | 2025-08-12 |
| 12261157 | Semiconductor device having package on package structure and method of manufacturing the semiconductor device | Jeonghyun Lee, Jihwang Kim | 2025-03-25 |
| 12261093 | Semiconductor packages having a dam structure | Dongho Kim, Hwanpil Park, Jangwoo Lee | 2025-03-25 |
| 12148729 | Semiconductor package structure having interposer substrate, and stacked semiconductor package structure including the same | Choongbin Yim, Jihwang Kim | 2024-11-19 |
| 12062605 | Semiconductor package including an interposer and method of fabricating the same | Ji Hwang Kim, Hyunkyu Kim, Eunhee Jung, Kyoungsei Choi | 2024-08-13 |
| 12033924 | Semiconductor package | Jeonghyun Lee, Hwanpil Park | 2024-07-09 |
| 12021036 | Semiconductor package including interposer and method of manufacturing the semiconductor package | Jihwang Kim, Choongbin Yim | 2024-06-25 |
| 11948873 | Semiconductor package including a support solder ball | Jeonghyun Lee, Dongwook Kim, Hwan Pil Park | 2024-04-02 |
| 11876083 | Semiconductor package | Dongho Kim, Ji Hwang Kim, Hwan Pil Park | 2024-01-16 |
| 11854989 | Semiconductor package substrate and semiconductor package including the same | Dongho Kim, Hwan Pil Park, Choongbin Yim, Jungwoo Kim | 2023-12-26 |
| 11804477 | Semiconductor device having package on package structure and method of manufacturing the semiconductor device | Jeonghyun Lee, Jihwang Kim | 2023-10-31 |
| 11798889 | Methods of manufacturing semiconductor packages | Choongbin Yim, Jungwoo Kim, Jihwang Kim, Kyoungsei Choi | 2023-10-24 |
| 11728230 | Semiconductor package and method of fabricating the same | Ji Hwang Kim, Dongho Kim, Jin-Woo Park | 2023-08-15 |
| 11710673 | Interposer and semiconductor package including the same | Choongbin Yim, Dongwook Kim, Hyunki Kim, Jihwang Kim, Sungkyu Park +2 more | 2023-07-25 |
| 11676949 | Semiconductor packages having supporting members | Taeseok Choi, Jihwang Kim | 2023-06-13 |
| 11658107 | Semiconductor package including an interposer and method of fabricating the same | Ji Hwang Kim, Hyunkyu Kim, Eunhee Jung, Kyoungsei Choi | 2023-05-23 |
| 11581263 | Semiconductor package, and package on package having the same | Choongbin Yim, Jungwoo Kim, Jihwang Kim, Jungsoo Byun, Doohwan Lee +3 more | 2023-02-14 |
| 11521934 | Semiconductor package including interposer and method of manufacturing the semiconductor package | Jihwang Kim, Choongbin Yim | 2022-12-06 |
| 11437293 | Semiconductor packages having a dam structure | Dongho Kim, Hwanpil Park, Jangwoo Lee | 2022-09-06 |
| 11404382 | Semiconductor package including an embedded semiconductor device | Jihwang Kim, Jeongmin Kang, Hyunkyu Kim, Kyoungsei Choi | 2022-08-02 |
| 11367714 | Semiconductor package device | Jangwoo Lee, Ji Hwang Kim, Yungcheol Kong, Youngbae Kim, Taehwan Kim +1 more | 2022-06-21 |
| 11367688 | Semiconductor package with interposer | Choongbin Yim, Jungwoo Kim, Jihwang Kim, Kyoungsei Choi | 2022-06-21 |
| 11367679 | Semiconductor package including an in interposer and method of fabricating the same | Ji Hwang Kim, Hyunkyu Kim, Eunhee Jung, Kyoungsei Choi | 2022-06-21 |
| 11152416 | Semiconductor package including a redistribution line | Ji Hwang Kim, Chajea Jo, Hyoeun Kim, Sang-Uk Han | 2021-10-19 |
| 10978431 | Semiconductor package with connection substrate and method of manufacturing the same | Ji Hwang Kim, Chajea Jo, Sang-Uk Han | 2021-04-13 |