Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12261093 | Semiconductor packages having a dam structure | Dongho Kim, Jongbo Shim, Jangwoo Lee | 2025-03-25 |
| 12136581 | Semiconductor package structure and fabrication method thereof | Youngho Kim | 2024-11-05 |
| 12033924 | Semiconductor package | Jeonghyun Lee, Jongbo Shim | 2024-07-09 |
| 11842941 | Semiconductor package structure and fabrication method thereof | Youngho Kim | 2023-12-12 |
| 11776913 | Semiconductor package and a package-on-package including the same | Dongho Kim | 2023-10-03 |
| 11437293 | Semiconductor packages having a dam structure | Dongho Kim, Jongbo Shim, Jangwoo Lee | 2022-09-06 |
| 11315851 | Semiconductor package structure and fabrication method thereof | Youngho Kim | 2022-04-26 |
| 10847435 | Semiconductor package structure and fabrication method thereof | Youngho Kim | 2020-11-24 |