Issued Patents All Time
Showing 26–33 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10923428 | Semiconductor package having second pad electrically connected through the interposer chip to the first pad | Ji Hwang Kim, Kilsoo Kim, Jangwoo Lee, Eunhee Jung | 2021-02-16 |
| 10748953 | Methods of forming redistribution lines and methods of manufacturing semiconductor devices using the same | Yonghoe Cho, Seunghoon Yeon, Won-Il Lee | 2020-08-18 |
| 10651224 | Semiconductor package including a redistribution line | Ji Hwang Kim, Chajea Jo, Hyoeun Kim, Sang-Uk Han | 2020-05-12 |
| 10636760 | Semiconductor packages | Seunghoon Yeon, Hyoeun Kim, Yonghoe Cho | 2020-04-28 |
| 10615213 | Methods of forming redistribution lines and methods of manufacturing semiconductor devices using the same | Yonghoe Cho, Seunghoon Yeon, Won-Il Lee | 2020-04-07 |
| 10361170 | Semiconductor package | Sungeun Pyo, Ji Hwang Kim, Chajea Jo, Sang-Uk Han | 2019-07-23 |
| 9425111 | Semiconductor package | Jin-Woo Park, Ji Hwang Kim | 2016-08-23 |
| 9112062 | Semiconductor device and method of manufacturing the same | JiSun Hong, Hyunki Kim, Seokwon Lee, Kyoungsei Choi | 2015-08-18 |