Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12283578 | Semiconductor package and method of fabricating same | Jeong Hyun Lee, Jong Bo Shim | 2025-04-22 |
| 11948873 | Semiconductor package including a support solder ball | Jeonghyun Lee, Dongwook Kim, Jongbo Shim | 2024-04-02 |
| 11908806 | Semiconductor package and method of fabricating the same | Dong Ho Kim, Ji Hwang Kim, Jong Bo Shim | 2024-02-20 |
| 11876083 | Semiconductor package | Dongho Kim, Ji Hwang Kim, Jongbo Shim | 2024-01-16 |
| 11854989 | Semiconductor package substrate and semiconductor package including the same | Dongho Kim, Jongbo Shim, Choongbin Yim, Jungwoo Kim | 2023-12-26 |
| 11239175 | Semiconductor package | Young-Ho Kim, Sung-Chul Kim, Key-One Ahn | 2022-02-01 |
| 7022628 | Method for forming quantum dots using metal thin film or metal powder | Young-Ho Kim, Yoon Chung, Hyoung Jun Jeon, Chong-Seung Yoon | 2006-04-04 |