Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394687 | Semiconductor package including a heat dissipation structure | Youngsang Cho | 2025-08-19 |
| 12123789 | Method and device for temperature detection and thermal management based on power measurement | Byungsu KIM, Inhwan Baek, Dongsuk Shin | 2024-10-22 |
| 11908774 | Semiconductor package including composite molding structure | Heeseok Lee | 2024-02-20 |
| 11837581 | Semiconductor package | Youngsang Cho, Heeseok Lee, Moonseob Jeong | 2023-12-05 |
| 11502061 | Semiconductor package | Youngsang Cho, Heeseok Lee, Moonseob Jeong | 2022-11-15 |
| 11373933 | Semiconductor package including composite molding structure | Heeseok Lee | 2022-06-28 |
| 11251102 | Semiconductor module including heat dissipation layer | Youngsang Cho | 2022-02-15 |
| 11037913 | Semiconductor package | Kyoung Min Lee, Kyungsoo Lee, HORANG JANG | 2021-06-15 |
| 10665574 | Semiconductor package | Kyoung Min Lee, Kyungsoo Lee, HORANG JANG | 2020-05-26 |
| 9978661 | Packaged semiconductor chips having heat dissipation layers and ground contacts therein | Oleg Feygenson, Sang-Il Kim, Youngbae Kim, Jichul Kim, Seungkon Mok +1 more | 2018-05-22 |
| 9583430 | Package-on-package device | Kyol Park, Jichul Kim, Eon Soo Jang | 2017-02-28 |
| 9391009 | Semiconductor packages including heat exhaust part | Eon Soo Jang, Kyol Park, Jongwoo Park, Jin-Kwon Bae, Jichul Kim +1 more | 2016-07-12 |
| 9356002 | Semiconductor package and method for manufacturing the same | — | 2016-05-31 |
| 9324696 | Package-on-package devices, methods of fabricating the same, and semiconductor packages | Mi-Na Choi, Seran Bae | 2016-04-26 |
| 9190338 | Semiconductor package having a heat slug and a spacer | Kyol Park, Eon Soo Jang | 2015-11-17 |
| 9029998 | Semiconductor package device | Eon Soo Jang, Kyol Park | 2015-05-12 |
| 9024434 | Semiconductor packages | Kyol Park, Taeje Cho | 2015-05-05 |
| 9013031 | Semiconductor packages including heat diffusion vias and interconnection vias | Jichul Kim, Kyol Park, Seongho Shin | 2015-04-21 |