| 9679874 |
Semiconductor package and semiconductor device including the same |
Jin-Kwon Bae, Jae Choon Kim, Jichul Kim, Chajea Jo |
2017-06-13 |
| 9666503 |
Semiconductor package and electronic system including the same |
Yun-Hyeok Im, Hee-Jung Hwang |
2017-05-30 |
| 9583430 |
Package-on-package device |
Jichul Kim, Yunhyeok Im, Eon Soo Jang |
2017-02-28 |
| 9482584 |
System and method for predicting the temperature of a device |
Yun-Hyeok Im, Tae-Je Cho |
2016-11-01 |
| 9391009 |
Semiconductor packages including heat exhaust part |
Eon Soo Jang, Jongwoo Park, Jin-Kwon Bae, Yunhyeok Im, Jichul Kim +1 more |
2016-07-12 |
| 9293389 |
Method of manufacturing a semiconductor package including a surface profile modifier |
Yun-Hyeok Im |
2016-03-22 |
| 9190338 |
Semiconductor package having a heat slug and a spacer |
Yunhyeok Im, Eon Soo Jang |
2015-11-17 |
| 9054067 |
Semiconductor package with thermal dissipating member and method of manufacturing the same |
Yun-Hyoek Im, Hee-Seok Lee |
2015-06-09 |
| 9029998 |
Semiconductor package device |
Eon Soo Jang, Yunhyeok Im |
2015-05-12 |
| 9024434 |
Semiconductor packages |
Yunhyeok Im, Taeje Cho |
2015-05-05 |
| 9013031 |
Semiconductor packages including heat diffusion vias and interconnection vias |
Yunhyeok Im, Jichul Kim, Seongho Shin |
2015-04-21 |
| 8921990 |
Semiconductor package |
Yun-Hyeok Im |
2014-12-30 |
| 8587134 |
Semiconductor packages |
Yun-Hyeok Im, Won Keun Kim, Tae-Je Cho |
2013-11-19 |
