Issued Patents All Time
Showing 1–25 of 64 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11043441 | Fan-out semiconductor package | Doo Hwan Lee | 2021-06-22 |
| 11018026 | Interposer, semiconductor package, and method of fabricating interposer | Un-Byoung Kang, Hyuek Jae Lee, Cha-Jea Jo | 2021-05-25 |
| 10903170 | Substrate having embedded interconnect structure | Doo Hwan Lee, Yong Hoon Kim, Jin Won Lee | 2021-01-26 |
| 10535534 | Method of fabricating an interposer | Un-Byoung Kang, Hyuek Jae Lee, Cha-Jea Jo | 2020-01-14 |
| 10497675 | Semiconductor device including multiple semiconductor chips | Byoung-Soo Kwak, Tae Hong Min, In-Young Lee | 2019-12-03 |
| 10134702 | Semiconductor chip, semiconductor package including the same, and method of manufacturing semiconductor chip | Sun-kyoung Seo, Seung-Kwan Ryu, Cha-Jea Jo | 2018-11-20 |
| 10008462 | Semiconductor package | Sun-kyoung Seo, Yong-Hwan Kwon, Hyung-Gil Baek, Hyun-Soo Chung, Seung-Kwan Ryu +1 more | 2018-06-26 |
| 9941196 | Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor device | Ho-Jin Lee, Dong-Hyeon Jang, Ho-Geon Song, Se-Young Jeong, Un-Byoung Kang +1 more | 2018-04-10 |
| 9929022 | Semiconductor chip package and method of manufacturing the same | Seok Hyun LEE, Yun-Seok Choi, Jin-Woo Park | 2018-03-27 |
| 9905538 | Chip-stacked semiconductor package and method of manufacturing the same | Un-Byoung Kang, Byung-Hyug Roh | 2018-02-27 |
| 9899337 | Semiconductor package and manufacturing method thereof | Gun-ho Chang, Jong Bo Shim | 2018-02-20 |
| 9893018 | Alignment mark for semiconductor device | Yeong Kwon Ko, Tae Hyeong Kim, Ji Hwang Kim, Sun-kyoung Seo | 2018-02-13 |
| 9875918 | Initiator and method for debonding wafer supporting system | Kyu-dong Jung, Jung-Hwan Kim, Dong Gil Lee, Kwang-chul Choi | 2018-01-23 |
| 9853012 | Semiconductor packages having through electrodes and methods of fabricating the same | Hyunsoo Chung, Jongyeon Kim, In-Young Lee | 2017-12-26 |
| 9831202 | Semiconductor devices with solder-based connection terminals and method of forming the same | Sun-kyoung Seo, Seung-Kwan Ryu, Ju-Il Choi, Yong-Hwan Kwon | 2017-11-28 |
| 9761477 | Pre-package and methods of manufacturing semiconductor package and electronic device using the same | Gun-ho Chang, Un-Byoung Kang | 2017-09-12 |
| 9728424 | Method of fabricating a packaged integrated circuit with through-silicon via an inner substrate | Ji Hwang Kim, Un-Byoung Kang, Cha-Jea Jo | 2017-08-08 |
| 9666551 | Semiconductor chip, semiconductor package including the same, and method of manufacturing semiconductor chip | Sun-kyoung Seo, Seung-Kwan Ryu, Cha-Jea Jo | 2017-05-30 |
| 9618716 | Photonic integrated circuit | Sang Cheon Park, Cha-Jea Jo | 2017-04-11 |
| 9601465 | Chip-stacked semiconductor package and method of manufacturing the same | Un-Byoung Kang, Byung-Hyug Roh | 2017-03-21 |
| 9589945 | Semiconductor package having stacked semiconductor chips | Cha-Jea Jo, Yun-Hyeok Im | 2017-03-07 |
| 9543231 | Stacked semiconductor package | Yun-Seok Choi, Hyeok-man Kwon, Cha-Jea Jo | 2017-01-10 |
| 9515057 | Semiconductor package and method of manufacturing the semiconductor package | Keum-Hee Ma, Ji Hwang Kim | 2016-12-06 |
| 9482584 | System and method for predicting the temperature of a device | Yun-Hyeok Im, Kyol Park | 2016-11-01 |
| 9478514 | Pre-package and methods of manufacturing semiconductor package and electronic device using the same | Gun-ho Chang, Un-Byoung Kang | 2016-10-25 |