Issued Patents All Time
Showing 51–64 of 64 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7928435 | Interposer chip and multi-chip package having the interposer chip | Sung Yong Park, Tae Hun Kim, Jong Kook Kim, Byeong-Yeon Cho | 2011-04-19 |
| 7884392 | Image sensor having through via | Hyuek Jae Lee, Yong-Hwan Kwon, Un-Byoung Kang, Chung-Sun Lee, Woon-Seong Kwon +1 more | 2011-02-08 |
| 7812442 | High-power ball grid array package, heat spreader used in the BGA package and method for manufacturing the same | Heung-Kyu Kwon, Min-ha Kim | 2010-10-12 |
| 7330084 | Printed circuit board having a bond wire shield structure for a signal transmission line | Hee-Seok Lee, Kyung-Lae Jang, Ki-Won Choi | 2008-02-12 |
| 7327038 | Semiconductor device package | Heung-Kyu Kwon, Kyung-Lae Jang | 2008-02-05 |
| 7304371 | Lead frame having a lead with a non-uniform width | Tae Hun Kim, Jong Bo Shim | 2007-12-04 |
| 7258808 | High-power ball grid array package, heat spreader used in the BGA package and method for manufacturing the same | Heung-Kyu Kwon, Min-ha Kim | 2007-08-21 |
| 7078800 | Semiconductor package | Heung-Kyu Kwon, Se-Yong Oh, Min-ha Kim | 2006-07-18 |
| 6952050 | Semiconductor package | Heung-Kyu Kwon, Se-Yong Oh, Min-ha Kim | 2005-10-04 |
| 6878570 | Thin stacked package and manufacturing method thereof | Ju-hyun Lyu, Kwan-Jai Lee | 2005-04-12 |
| 6849949 | Thin stacked package | Ju-hyun Lyu, Kwan-Jai Lee | 2005-02-01 |
| 6518660 | Semiconductor package with ground projections | Heung-Kyu Kwon, Young-Hoon Ro | 2003-02-11 |
| 6087722 | Multi-chip package | Kwan-Jai Lee, Young Jae Song, Do Soo Jeong, Suk Chang, Chang-Cheol Lee +2 more | 2000-07-11 |
| 5897339 | Lead-on-chip semiconductor device package having an adhesive layer formed from liquid adhesive and method for manufacturing the same | Young Jae Song, Se-Yong Oh, Seung Ho Ahn, Min Ho Lee | 1999-04-27 |