Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8941245 | Semiconductor package including semiconductor chip with through opening | Hyun Jun Kim, In-Young Lee, Ki-Kwon Jeong | 2015-01-27 |
| 7374966 | Apparatus for stacking semiconductor chips, method for manufacturing semiconductor package using the same and semiconductor package manufactured thereby | Min-Ill Kim, Dong-Kuk Kim, Tae-Hoe Hwang, Jae-young Hong | 2008-05-20 |
| 7298032 | Semiconductor multi-chip package and fabrication method | Dong-Kuk Kim | 2007-11-20 |
| 7148080 | Method for joining lead frames in a package assembly, method for forming a chip stack package, and a chip stack package | Pyoung-Wan Kim, Sang-Hyeop Lee, Gun Lee | 2006-12-12 |
| 7135353 | Apparatus for stacking semiconductor chips, method for manufacturing semiconductor package using the same and semiconductor package manufactured thereby | Min-Ill Kim, Dong-Kuk Kim, Tae-Hoe Hwang, Jae-young Hong | 2006-11-14 |
| 7096914 | Apparatus for bonding a chip using an insulating adhesive tape | Dong-Kuk Kim, Min-Il Kim, Sang-Yeop Lee | 2006-08-29 |
| 6087722 | Multi-chip package | Kwan-Jai Lee, Young Jae Song, Do Soo Jeong, Tae-Je Cho, Suk Chang +2 more | 2000-07-11 |