Gun Lee has been granted 10 US patents while listed as an inventor at Samsung . The first was granted in 2006 and the most recent in June 2025. Gun Lee ranks #481,000 of 4,157,543 US inventors in our database (top 11.6%). Patent records list Gun Lee in Yongin-si, KR.
Patents per Year Patents granted per year, 2006 to 2025 Bar chart with a peak of 2 patents in 2020. peak 2 2006: 1 patents 2006 2019: 1 patents 2019 2020: 2 patents 2020 2021: 2 patents 2021 2023: 1 patents 2023 2024: 1 patents 2024 2025: 2 patents 2025
Issued Patents All Time
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Showing 1–10 of 10 patents
Patent # Title Co-Inventors Date
12341118 Semiconductor package including an encapsulant Seungwan Shin , Junghoon Kang 2025-06-24
12272666 Semiconductor package and method of manufacturing the same Eunsil Kim , Seunghan Sim 2025-04-08
12154859 Semiconductor package and method of manufacturing same Woonchun Kim , Seungwan Shin 2024-11-26
11837537 Fan-out semiconductor package Bongju Cho , Myungsam Kang , Younggwan Ko , Jaekul Lee 2023-12-05
11127692 Semiconductor package Jun Gul Hwang , Ji Eun Woo , Sung Keun Park 2021-09-21
11121079 Fan-out semiconductor package Bongju Cho , Myungsam Kang , Younggwan Ko , Jaekul Lee 2021-09-14
10847474 Semiconductor package and electromagnetic interference shielding structure for the same Woon Chun Kim , Jun Heyoung Park , Ji Hye Shim , Sung Keun Park 2020-11-24
10790255 Fan-out semiconductor package Woon Chun Kim , Jun Heyoung Park , Ji Hye Shim , Sung Keun Park 2020-09-29
10483150 Apparatus for stacking semiconductor chips in a semiconductor package Ji Hwan Hwang , Cha-Jea Jo , Dong-Han Kim , Seung-Kon Mok 2019-11-19
7148080 Method for joining lead frames in a package assembly, method for forming a chip stack package, and a chip stack package Pyoung-Wan Kim , Sang-Hyeop Lee , Chang-Cheol Lee 2006-12-12
