Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12374667 | Semiconductor package and method of manufacturing the same | Byungmin Yu, Junghyun Lee | 2025-07-29 |
| 12341118 | Semiconductor package including an encapsulant | Seungwan Shin, Gun Lee | 2025-06-24 |
| 12230580 | Method of manufacturing semiconductor package, and semiconductor package | — | 2025-02-18 |
| 12100668 | Semiconductor package | — | 2024-09-24 |
| 11929315 | Semiconductor package having pad with regular and irregular depressions and protrusions and method of manufacturing the same | — | 2024-03-12 |
| 11837553 | Semiconductor package | — | 2023-12-05 |
| 11798814 | Semiconductor package, electronic apparatus and method of manufacturing the semiconductor package | — | 2023-10-24 |
| 11348807 | Semiconductor package, electronic apparatus and method of manufacturing the semiconductor package | — | 2022-05-31 |
| 9879775 | Shifting lever assembly | Keehwan Kwon, Suntae Jung, Wonhun Jung, Sangkook Kang, Jueun Shin | 2018-01-30 |