Issued Patents All Time
Showing 1–25 of 36 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394708 | Semiconductor package | Youngchan Ko, Jeongseok Kim, Bongju Cho | 2025-08-19 |
| 12334445 | Method of fabricating a semiconductor package | Youngchan Ko, Taesung Jeong | 2025-06-17 |
| 12327826 | Semiconductor package | Yongkoon Lee, Youngchan Ko | 2025-06-10 |
| 12278191 | Semiconductor packages having wiring patterns | Youngchan Ko, Jeongseok Kim, Bongju Cho | 2025-04-15 |
| 12261105 | Semiconductor package | Youngchan Ko, Jeongseok Kim, Kyung Don Mun, Bongju Cho | 2025-03-25 |
| 12183665 | Semiconductor package | Youngchan Ko, Jeongseok Kim, Kyung Don Mun | 2024-12-31 |
| 12159826 | Semiconductor package and method of manufacturing the semiconductor package | Youngchan Ko, Jeongseok Kim, Kyungdon Mun | 2024-12-03 |
| 12119305 | Semiconductor package | Kyungdon Mun, Youngchan Ko, Yieok Kwon, Jeongseok Kim, Gongje Lee +1 more | 2024-10-15 |
| 12094817 | Semiconductor package | Youngchan Ko, Kyungdon Mun | 2024-09-17 |
| 12062632 | Semiconductor package device | Kyung Don Mun | 2024-08-13 |
| 12057380 | Semiconductor package | Bongju Cho | 2024-08-06 |
| 12046562 | Semiconductor package | Youngchan Ko, Jeongseok Kim, Bongju Cho | 2024-07-23 |
| 12040297 | Methods of manufacturing semiconductor packages | Youngchan Ko, Jeongseok Kim, Kyungdon Mun | 2024-07-16 |
| 12021020 | Semiconductor package | Youngchan Ko, Jeongseok Kim, Bongju Cho | 2024-06-25 |
| 12002798 | Fan-out type semiconductor package and method of manufacturing the same | Youngchan Ko, Yongjin Park | 2024-06-04 |
| 11935849 | Semiconductor package with an antenna substrate | Sangkyu Lee, Yongkoon Lee | 2024-03-19 |
| 11935847 | Semiconductor package | Changbae Lee, Bongju Cho, Younggwan Ko, Yongkoon Lee, Moonil Kim +1 more | 2024-03-19 |
| 11916002 | Semiconductor package | Youngchan Ko, Jeongseok Kim, Kyung Don Mun | 2024-02-27 |
| 11842950 | Package module | Yongjin Park, Younggwan Ko | 2023-12-12 |
| 11837537 | Fan-out semiconductor package | Bongju Cho, Younggwan Ko, Gun Lee, Jaekul Lee | 2023-12-05 |
| 11804444 | Semiconductor package including heat dissipation structure | Yongjin Park, Youngchan Ko, Seonho Lee | 2023-10-31 |
| 11784129 | Semiconductor package and method of fabricating the same | Youngchan Ko, Taesung Jeong | 2023-10-10 |
| 11721620 | Fan-out type semiconductor package | Youngchan Ko, Jeongseok Kim, Bongju Cho | 2023-08-08 |
| 11676927 | Semiconductor package device | Kyung Don Mun | 2023-06-13 |
| 11626367 | Semiconductor package | Youngchan Ko, Kyungdon Mun | 2023-04-11 |