Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12119305 | Semiconductor package | Kyungdon Mun, Myungsam Kang, Youngchan Ko, Jeongseok Kim, Gongje Lee +1 more | 2024-10-15 |
| 11569175 | Semiconductor package | Kyungdon Mun, Myungsam Kang, Youngchan Ko, Jeongseok Kim, Gongje Lee +1 more | 2023-01-31 |
| 11398420 | Semiconductor package having core member and redistribution substrate | Kyungdon Mun, Myungsam Kang, Youngchan Ko, Jeongseok Kim, Gongje Lee +1 more | 2022-07-26 |
| 10930525 | Carrier substrate and method of manufacturing semiconductor package using the carrier substrate | Ikjun Choi | 2021-02-23 |