Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12159826 | Semiconductor package and method of manufacturing the semiconductor package | Myungsam Kang, Youngchan Ko, Jeongseok Kim | 2024-12-03 |
| 12119305 | Semiconductor package | Myungsam Kang, Youngchan Ko, Yieok Kwon, Jeongseok Kim, Gongje Lee +1 more | 2024-10-15 |
| 12094817 | Semiconductor package | Myungsam Kang, Youngchan Ko | 2024-09-17 |
| 12040297 | Methods of manufacturing semiconductor packages | Myungsam Kang, Youngchan Ko, Jeongseok Kim | 2024-07-16 |
| 11942434 | Method of manufacturing a semiconductor package | Sangkyu Lee, Jingu Kim, Shanghoon Seo, Jeongho Lee | 2024-03-26 |
| 11626367 | Semiconductor package | Myungsam Kang, Youngchan Ko | 2023-04-11 |
| 11581284 | Semiconductor package with under-bump metal structure | Myungsam Kang, Youngchan Ko, Jeongseok Kim | 2023-02-14 |
| 11569175 | Semiconductor package | Myungsam Kang, Youngchan Ko, Yieok Kwon, Jeongseok Kim, Gongje Lee +1 more | 2023-01-31 |
| 11538737 | Semiconductor package | Myungsam Kang, Youngchan Ko | 2022-12-27 |
| 11398420 | Semiconductor package having core member and redistribution substrate | Myungsam Kang, Youngchan Ko, Yieok Kwon, Jeongseok Kim, Gongje Lee +1 more | 2022-07-26 |
| 11342274 | Semiconductor package | Sangkyu Lee, Jingu Kim, Shanghoon Seo, Jeongho Lee | 2022-05-24 |