Semiconductor package having core member and redistribution substrate

Assignee

• Samsung

Inventors

• Kyungdon Mun (11 patents)
• Myungsam Kang (36 patents)
• Youngchan Ko (28 patents)
• Yieok Kwon (4 patents)
• Jeongseok Kim (23 patents)
• Gongje Lee (3 patents)
• Bongju Cho (16 patents)

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