BC

Bongju Cho

Samsung: 16 patents #8,525 of 75,807Top 15%
Overall (All Time): #283,902 of 4,157,543Top 7%
16
Patents All Time

Issued Patents All Time

Showing 1–16 of 16 patents

Patent #TitleCo-InventorsDate
12394708 Semiconductor package Myungsam Kang, Youngchan Ko, Jeongseok Kim 2025-08-19
12278191 Semiconductor packages having wiring patterns Youngchan Ko, Myungsam Kang, Jeongseok Kim 2025-04-15
12261105 Semiconductor package Myungsam Kang, Youngchan Ko, Jeongseok Kim, Kyung Don Mun 2025-03-25
12119305 Semiconductor package Kyungdon Mun, Myungsam Kang, Youngchan Ko, Yieok Kwon, Jeongseok Kim +1 more 2024-10-15
12057380 Semiconductor package Myungsam Kang 2024-08-06
12046562 Semiconductor package Myungsam Kang, Youngchan Ko, Jeongseok Kim 2024-07-23
12021020 Semiconductor package Myungsam Kang, Youngchan Ko, Jeongseok Kim 2024-06-25
11935847 Semiconductor package Myungsam Kang, Changbae Lee, Younggwan Ko, Yongkoon Lee, Moonil Kim +1 more 2024-03-19
11837537 Fan-out semiconductor package Myungsam Kang, Younggwan Ko, Gun Lee, Jaekul Lee 2023-12-05
11721620 Fan-out type semiconductor package Myungsam Kang, Youngchan Ko, Jeongseok Kim 2023-08-08
11569158 Semiconductor package Myungsam Kang, Youngchan Ko, Jeongseok Kim, Kyung Don Mun 2023-01-31
11569175 Semiconductor package Kyungdon Mun, Myungsam Kang, Youngchan Ko, Yieok Kwon, Jeongseok Kim +1 more 2023-01-31
11562966 Semiconductor package Myungsam Kang, Youngchan Ko, Jeongseok Kim 2023-01-24
11398420 Semiconductor package having core member and redistribution substrate Kyungdon Mun, Myungsam Kang, Youngchan Ko, Yieok Kwon, Jeongseok Kim +1 more 2022-07-26
11329014 Semiconductor package Myungsam Kang, Changbae Lee, Younggwan Ko, Yongkoon Lee, Moonil Kim +1 more 2022-05-10
11121079 Fan-out semiconductor package Myungsam Kang, Younggwan Ko, Gun Lee, Jaekul Lee 2021-09-14