Issued Patents All Time
Showing 26–36 of 36 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11581284 | Semiconductor package with under-bump metal structure | Youngchan Ko, Jeongseok Kim, Kyungdon Mun | 2023-02-14 |
| 11569175 | Semiconductor package | Kyungdon Mun, Youngchan Ko, Yieok Kwon, Jeongseok Kim, Gongje Lee +1 more | 2023-01-31 |
| 11569158 | Semiconductor package | Youngchan Ko, Jeongseok Kim, Kyung Don Mun, Bongju Cho | 2023-01-31 |
| 11562966 | Semiconductor package | Youngchan Ko, Jeongseok Kim, Bongju Cho | 2023-01-24 |
| 11538737 | Semiconductor package | Youngchan Ko, Kyungdon Mun | 2022-12-27 |
| 11527495 | Semiconductor package with an antenna substrate | Sangkyu Lee, Yongkoon Lee | 2022-12-13 |
| 11508639 | System in package (SiP) semiconductor package | Yongjin Park, Youngchan Ko | 2022-11-22 |
| 11398420 | Semiconductor package having core member and redistribution substrate | Kyungdon Mun, Youngchan Ko, Yieok Kwon, Jeongseok Kim, Gongje Lee +1 more | 2022-07-26 |
| 11387225 | Fan-out type semiconductor package and method of manufacturing the same | Youngchan Ko, Yongjin Park | 2022-07-12 |
| 11329014 | Semiconductor package | Changbae Lee, Bongju Cho, Younggwan Ko, Yongkoon Lee, Moonil Kim +1 more | 2022-05-10 |
| 11121079 | Fan-out semiconductor package | Bongju Cho, Younggwan Ko, Gun Lee, Jaekul Lee | 2021-09-14 |