Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12334445 | Method of fabricating a semiconductor package | Myungsam Kang, Youngchan Ko | 2025-06-17 |
| 12218099 | Interposer and semiconductor package including the same | Jungsoo Byun, Younggwan Ko, Jaeean Lee | 2025-02-04 |
| 11784129 | Semiconductor package and method of fabricating the same | Myungsam Kang, Youngchan Ko | 2023-10-10 |
| 11676915 | Semiconductor package | Doohwan Lee, Hongwon KIM, Junggon Choi | 2023-06-13 |
| 11088115 | Interposer and semiconductor package including the same | Jungsoo Byun, Younggwan Ko, Jaeean Lee | 2021-08-10 |