Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10105102 | Package for processing sensed-data, sensed-data processor, and system for processing sensed-data | Mitsuo Umemoto, Yung-Cheol Kong, Woon-bae Kim, Kyong-Soon Cho | 2018-10-23 |
| 9793309 | Image sensor package | Byoung-Rim Seo, Yoon Young CHOI, Kyoung-Sei Choi, Chang-soo Jin, Seung-Kon Mok +1 more | 2017-10-17 |
| 8846446 | Semiconductor package having buried post in encapsulant and method of manufacturing the same | Teak-Hoon Lee, Chul-Yong Jang | 2014-09-30 |
| 8373261 | Chip stack package and method of fabricating the same | Min-Seung Yoon, Nam-Seog Kim, Keum-Hee Ma | 2013-02-12 |
| 8344497 | Semiconductor package and electronic device having the same | Eun-Chul Ahn, Teak-Hoon Lee, Chul-Yong Jang | 2013-01-01 |
| 8154122 | Semiconductor package and methods of manufacturing the semiconductor package | Chul-Yong Jang, Teak-Hoon Lee | 2012-04-10 |
| 8093703 | Semiconductor package having buried post in encapsulant and method of manufacturing the same | Teak-Hoon Lee, Chul-Yong Jang | 2012-01-10 |
| 8008771 | Semiconductor chip package, electronic device including the semiconductor chip package and methods of fabricating the electronic device | Eun-Chul Ahn, Jong Ho Lee, Teak-Hoon Lee, Chul-Yong Jang | 2011-08-30 |
| 7898075 | Semiconductor package having resin substrate with recess and method of fabricating the same | Chul-Yong Jang, Eun-Chul Ahn, Taek-Hoon Lee | 2011-03-01 |
| 7807512 | Semiconductor packages and methods of fabricating the same | Teak-Hoon Lee, Nam-Seog Kim, Chul-Yong Jang | 2010-10-05 |
| 7626254 | Semiconductor package using chip-embedded interposer substrate | Min-Ho O, Jong Ho Lee, Eun-Chul Ahn | 2009-12-01 |
| 7521810 | Chip stack package and manufacturing method thereof | In-Ku Kang | 2009-04-21 |
| 7498679 | Package substrate and semiconductor package using the same | Jung-Seok Ryu | 2009-03-03 |
| 7148080 | Method for joining lead frames in a package assembly, method for forming a chip stack package, and a chip stack package | Sang-Hyeop Lee, Chang-Cheol Lee, Gun Lee | 2006-12-12 |
| 6946328 | Method for manufacturing semiconductor devices | Tae-Sung Yoon, Hyeon Deuk Hwang | 2005-09-20 |
| 6498389 | Ultra-thin semiconductor package device using a support tape | — | 2002-12-24 |