Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11705391 | Interposer and semiconductor package including the same | Yu-Kyung Park, Seung-Kwan Ryu, Yun-Seok Choi | 2023-07-18 |
| 11081440 | Interposer and semiconductor package including the same | Yu-Kyung Park, Seung-Kwan Ryu, Yun-Seok Choi | 2021-08-03 |
| 9941196 | Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor device | Ho-Jin Lee, Tae-Je Cho, Dong-Hyeon Jang, Ho-Geon Song, Se-Young Jeong +1 more | 2018-04-10 |
| 9343361 | Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor device | Ho-Jin Lee, Tae-Je Cho, Dong-Hyeon Jang, Ho-Geon Song, Se-Young Jeong +1 more | 2016-05-17 |
| 8592991 | Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor device | Ho-Jin Lee, Tae-Je Cho, Dong-Hyeon Jang, Ho-Geon Song, Se-Young Jeong +1 more | 2013-11-26 |
| 8513802 | Multi-chip package having semiconductor chips of different thicknesses from each other and related device | Keum-Hee Ma, Woo-Dong Lee, Ju-Il Choi, Sang-Sick Park, Son-Kwan Hwang | 2013-08-20 |
| 8415804 | Semiconductor chip, method of fabricating the same, and stack module and memory card including the same | Ho-Jin Lee, Dong-Hyun Jang, In-Young Lee, Son-Kwan Hwang | 2013-04-09 |
| 8373261 | Chip stack package and method of fabricating the same | Pyoung-Wan Kim, Nam-Seog Kim, Keum-Hee Ma | 2013-02-12 |
| 8183673 | Through-silicon via structures providing reduced solder spreading and methods of fabricating the same | Son-Kwan Hwang, Keum-Hee Ma, Seung Woo Shin, Jong-Ho Yun, Ui-Hyoung Lee | 2012-05-22 |
| 8114772 | Method of manufacturing the semiconductor device | Kyu-Ha Lee, Ui-Hyoung Lee, Ju-II Choi, Nam-Seog Kim, Keum-Hee Ma | 2012-02-14 |