Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12319223 | Driver seat airbag device for vehicle and method for manufacturing same | Yune Jae Shin, Youn Bock Lee, Seung Jin Lee, Dong Young Kim, Hyeon Gyo Park | 2025-06-03 |
| 12115261 | Block copolymer comprising hydrophilic first block, hydrophobic second block, and functional group capable of specifically binding to thiol | Won-Jong Kim | 2024-10-15 |
| 12108674 | Parallel thermoelectric module | Seo Young Kim, Sung Hoon Park, Keun Hee Lee | 2024-10-01 |
| 11760296 | Vehicular airbag device | Seung Jin Lee, Dong Young Kim | 2023-09-19 |
| 8426252 | Wafer level package having a stress relief spacer and manufacturing method thereof | Hyun-Soo Chung, Ho-Jin Lee, Dong-Ho Lee | 2013-04-23 |
| 8415804 | Semiconductor chip, method of fabricating the same, and stack module and memory card including the same | Ho-Jin Lee, In-Young Lee, Min-Seung Yoon, Son-Kwan Hwang | 2013-04-09 |
| 8232644 | Wafer level package having a stress relief spacer and manufacturing method thereof | Hyun-Soo Chung, Ho-Jin Lee, Dong-Ho Lee | 2012-07-31 |
| 8120177 | Wafer level package having a stress relief spacer and manufacturing method thereof | Hyun-Soo Chung, Ho-Jin Lee, Dong-Ho Lee | 2012-02-21 |
| 7838992 | Wafer level package having a stress relief spacer and manufacturing method thereof | Hyun-Soo Chung, Ho-Jin Lee, Dong-Ho Lee | 2010-11-23 |
| 7572673 | Wafer level package having a stress relief spacer and manufacturing method thereof | Hyun-Soo Chung, Ho-Jin Lee, Dong-Ho Lee | 2009-08-11 |