Issued Patents All Time
Showing 1–25 of 60 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12237309 | Semiconductor package having pads with stepped structure | Myung-Kee Chung, Tae Won Yoo | 2025-02-25 |
| 11955464 | Semiconductor package having pads with stepped structure | Myung-Kee Chung, Tae Won Yoo | 2024-04-09 |
| 11797128 | Touch sensing circuit including adjustable filter and touch sensing method thereof | Kyu-Tae Lee, Mun-Seok Kang, Jae Hwan LEE, Jeong Kwon Nam, Jin Yoon Jang +1 more | 2023-10-24 |
| 11768558 | Touch sensing circuit and its method for sensing multi-frequency signals | Kyu-Tae Lee, Mun-Seok Kang, Jae Hwan LEE, Jeong Kwon Nam, Jin Yoon Jang +2 more | 2023-09-26 |
| 11705376 | Semiconductor chip including chip pad, redistribution wiring test pad, and redistribution wiring connection pad | Myeong-Soon Park, Chan-Ho Lee | 2023-07-18 |
| 11586323 | Touch circuit and touch sensing method | Jae Hwan LEE, Mun-Seok Kang, Jeong Kwon Nam, Kyu-Tae Lee, Jin Yoon Jang +2 more | 2023-02-21 |
| 11574892 | Semiconductor package having pads with stepped structure | Myung-Kee Chung, Tae Won Yoo | 2023-02-07 |
| 11294524 | Touch sensing device and method | Hee Jin Lee, Jae Hwan LEE, Jeong Kwon Nam, Kyu-Tae Lee, Jin Yoon Jang +3 more | 2022-04-05 |
| 11189535 | Semiconductor chip including chip pad, redistribution wiring test pad, and redistribution wiring connection pad | Myeong-Soon Park, Chan-Ho Lee | 2021-11-30 |
| D930873 | Lamp with sound | Hye Cho Shin, Jeong Ho SON, Ah Ra Cho, Chi-Young Lee, Duck Su Oh +2 more | 2021-09-14 |
| 11031347 | Semiconductor packages | Young Lyong Kim, Dong-Hyeon Jang | 2021-06-08 |
| 11029777 | Touch sensing device and display apparatus including the same | Hee Jin Lee, Jae Hwan LEE, Jeong Kwon Nam, Kyu-Tae Lee, Jin Yoon Jang +3 more | 2021-06-08 |
| 10942606 | Touch sensing device of current driving type | Hee Jin Lee, Jae Hwan LEE, Jeong Kwon Nam, Kyu-Tae Lee, Jin Yoon Jang +3 more | 2021-03-09 |
| 10942604 | Touch sensing device and display apparatus including the same | Hee Jin Lee, Jae Hwan LEE, Jeong Kwon Nam, Kyu-Tae Lee, Jin Yoon Jang +3 more | 2021-03-09 |
| 10930610 | Semiconductor chip including a bump structure and semiconductor package including the same | Jin-Kuk Bae, Han-Sung Ryu, In-Young Lee, Chan-Ho Lee | 2021-02-23 |
| 10840159 | Semiconductor chip including chip pad, redistribution wiring test pad, and redistribution wiring connection pad | Myeong-Soon Park, Chan-Ho Lee | 2020-11-17 |
| D887071 | Lamp with sound organic light emitting diode (OLED) coupled thereto | Hye Cho Shin, Jeong Ho SON, Ah Ra Cho, Chi-Young Lee, Duck Su Oh +2 more | 2020-06-09 |
| 10438899 | Semiconductor packages | Young Lyong Kim, Dong-Hyeon Jang | 2019-10-08 |
| 10008462 | Semiconductor package | Sun-kyoung Seo, Tae-Je Cho, Yong-Hwan Kwon, Hyung-Gil Baek, Seung-Kwan Ryu +1 more | 2018-06-26 |
| 9698051 | Semiconductor chips having through silicon vias and related fabrication methods and semiconductor packages | Jin-ho Chun, Byung-Iyul Park, Gil-Heyun Choi, Son-Kwan Hwang | 2017-07-04 |
| 9412707 | Method of manufacturing semiconductor package | Tae-Je Cho, Jung-Seok Ahn, In-Young Lee | 2016-08-09 |
| 8957526 | Semiconductor chips having through silicon vias and related fabrication methods and semiconductor packages | Jin-ho Chun, Byung-Lyul Park, Gil-Heyun Choi, Son-Kwan Hwang | 2015-02-17 |
| 8952543 | Via connection structures, semiconductor devices having the same, and methods of fabricating the structures and devices | Ho-Jin Lee, Pil-Kyu Kang, Kyu-Ha Lee, Byung-Lyul Park, Gil-Heyun Choi | 2015-02-10 |
| 8735281 | Inter connection structure including copper pad and pad barrier layer, semiconductor device and electronic apparatus including the same | Chang-Woo Shin, Eun-Chul Ahn, Jum-Gon Kim, Jin-ho Chun | 2014-05-27 |
| 8735276 | Semiconductor packages and methods of manufacturing the same | Jae-Shin Cho, Dong-Ho Lee, Dong-Hyeon Jang, Seong-Deok Hwang, Seung-Duk Baek | 2014-05-27 |