Issued Patents All Time
Showing 51–60 of 60 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7592709 | Board on chip package and method of manufacturing the same | Dong-Hyeon Jang, Dong-Ho Lee, In-Young Lee | 2009-09-22 |
| 7572673 | Wafer level package having a stress relief spacer and manufacturing method thereof | Ho-Jin Lee, Dong-Hyun Jang, Dong-Ho Lee | 2009-08-11 |
| 7544538 | Method of forming semiconductor chips, the semiconductor chips so formed and chip-stack package having the same | Seung-Kwan Ryu, Ju-Il Choi, Dong-Ho Lee, Seong-Deok Hwang | 2009-06-09 |
| 7545027 | Wafer level package having redistribution interconnection layer and method of forming the same | In-Young Lee, Dong-Hyeon Jang, Myeong-Soon Park, Dong-Ho Lee | 2009-06-09 |
| 7312143 | Wafer level chip scale package having a gap and method for manufacturing the same | Myeong-Soon Park, In-Young Lee, Jae-Sik Chung, Sung-Min Sim, Dong-Hyeon Jang +2 more | 2007-12-25 |
| 7205660 | Wafer level chip scale package having a gap and method for manufacturing the same | Myeong-Soon Park, In-Young Lee, Jae-Sik Chung, Sung-Min Sim, Dong-Hyeon Jang +2 more | 2007-04-17 |
| 6713595 | Copolyester resin composition and a process of preparation thereof | Jae Wang Lee, Dong Hoon Kim, Do-Youn Kim, Suok Woo Lee | 2004-03-30 |
| 6399716 | Copolyester resin composition and a process of preparation thereof | Jae Wang Lee, Dong Hoon Kim, Do-Youn Kim, Suok Woo Lee | 2002-06-04 |
| 6280350 | Golf tee | — | 2001-08-28 |
| 6063895 | Polyester resin and a process for preparing the same | Jae Wang Lee, Dong Hoon Kim, Jung Nam Jun, Sock Woo Lee | 2000-05-16 |