Issued Patents All Time
Showing 26–50 of 60 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8637989 | Semiconductor chip having via electrodes and stacked semiconductor chips interconnected by the via electrodes | Ho-Jin Lee, Chang-Seong Jeon, Sang-Sick Park, Jae-hyun Phee | 2014-01-28 |
| 8482129 | Wafer-level stack package and method of fabricating the same | In-Young Lee, Ho-Jin Lee, Ju-Il Choi, Son-Kwan Hwang | 2013-07-09 |
| 8456012 | Inter connection structure including copper pad and pad barrier layer, semiconductor device and electronic apparatus including the same | Chang-Woo Shin, Eun-Chul Ahn, Jum-Gon Kim, Jin-ho Chun | 2013-06-04 |
| 8431479 | Semiconductor devices having redistribution structures and packages, and methods of forming the same | Ki Hyuk Kim, Nam-Seog Kim, Seok Ho Kim, Myeong-Soon Park, Chang-Woo Shin | 2013-04-30 |
| 8426252 | Wafer level package having a stress relief spacer and manufacturing method thereof | Ho-Jin Lee, Dong-Hyun Jang, Dong-Ho Lee | 2013-04-23 |
| 8232644 | Wafer level package having a stress relief spacer and manufacturing method thereof | Ho-Jin Lee, Dong-Hyun Jang, Dong-Ho Lee | 2012-07-31 |
| 8193637 | Semiconductor package and multi-chip package using the same | Myeong-Soon Park, Seok Ho Kim, Ki Hyuk Kim, Chang-Woo Shin | 2012-06-05 |
| 8143693 | Semiconductor device including redistribution line structure and method of fabricating the same | Seung-Duk Baek, Sun-Won Kang | 2012-03-27 |
| 8120177 | Wafer level package having a stress relief spacer and manufacturing method thereof | Ho-Jin Lee, Dong-Hyun Jang, Dong-Ho Lee | 2012-02-21 |
| 8111520 | Semiconductor module | Dong-Ho Lee, Dong-Han Kim, Seong-Deok Hwang, Ki Hyuk Kim | 2012-02-07 |
| 8110922 | Wafer level semiconductor module and method for manufacturing the same | Seung-Duk Baek, Dong-Ho Lee, Dong-Hyeon Jang, Seong-Deok Hwang | 2012-02-07 |
| 8039937 | Method of forming semiconductor chips, the semiconductor chips so formed and chip-stack package having the same | Seung-Kwan Ryu, Ju-Il Choi, Dong-Ho Lee, Seong-Deok Hwang | 2011-10-18 |
| 7969024 | Semiconductor package with joint reliability, entangled wires including insulating material | Jae-Shin Cho, Seong-Deok Hwang, Jum-Gon Kim, Ki Hyuk Kim | 2011-06-28 |
| 7948089 | Chip stack package and method of fabricating the same | Dong-Ho Lee, Nam-Seog Kim, Son-Kwan Hwang | 2011-05-24 |
| 7923296 | Board on chip package and method of manufacturing the same | Dong-Hyeon Jang, Dong-Ho Lee, In-Young Lee | 2011-04-12 |
| 7897511 | Wafer-level stack package and method of fabricating the same | In-Young Lee, Ho-Jin Lee, Ju-Il Choi, Son-Kwan Hwang | 2011-03-01 |
| 7851256 | Method of manufacturing chip-on-chip semiconductor device | Dong-Ho Lee, Seong-Deok Hwang, Sun-Won Kang, Seung-Duk Baek | 2010-12-14 |
| 7847416 | Wafer level package and method of fabricating the same | In-Young Lee, Son-Kwan Hwang, Dong-Ho Lee, Seong-Deok Hwang | 2010-12-07 |
| 7838992 | Wafer level package having a stress relief spacer and manufacturing method thereof | Ho-Jin Lee, Dong-Hyun Jang, Dong-Ho Lee | 2010-11-23 |
| 7830017 | Wafer level chip scale package, method of manufacturing the same, and semiconductor chip module including the wafer level chip scale package | In-Young Lee, Dong-Ho Lee, Nam-Seog Kim, Ho-Jin Lee, Myeong-Soo Park | 2010-11-09 |
| 7777345 | Semiconductor device having through electrode and method of fabricating the same | Ho-Jin Lee, Nam-Seog Kim, Yong-Chai Kwon, In-Young Lee, Son-Kwan Hwang | 2010-08-17 |
| 7767576 | Wafer level package having floated metal line and method thereof | Seung-Duk Baek, Ju-Il Choi, Dong-Ho Lee | 2010-08-03 |
| 7740145 | Bottle cap | — | 2010-06-22 |
| 7626260 | Stack-type semiconductor device having cooling path on its bottom surface | Cha-Jea Jo, Dong-Ho Lee, Seong-Deok Hwang | 2009-12-01 |
| 7598607 | Semiconductor packages with enhanced joint reliability and methods of fabricating the same | Dong-Hyeon Jang, Nam-Seog Kim, Sun-Won Kang | 2009-10-06 |