Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7830017 | Wafer level chip scale package, method of manufacturing the same, and semiconductor chip module including the wafer level chip scale package | In-Young Lee, Dong-Ho Lee, Nam-Seog Kim, Hyun-Soo Chung, Ho-Jin Lee | 2010-11-09 |