Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11489184 | Electrolyte including mixture of active material and precursor thereof | Won Mi LEE, Gyun Ho Park | 2022-11-01 |
| 8367472 | Method of fabricating a 3-D device | Jong Ho Lee, Dong-Ho Lee, Eun-Chul Ahn | 2013-02-05 |
| 8053807 | Semiconductor packages, stacked semiconductor packages, and methods of manufacturing the semiconductor packages and the stacked semiconductor packages | Dong-Ho Lee | 2011-11-08 |
| 7939947 | Semiconductor package structure | Dong-Ho Lee | 2011-05-10 |
| 7915710 | Method of fabricating a semiconductor device, and semiconductor device with a conductive member extending through a substrate and connected to a metal pattern bonded to the substrate | Jong Ho Lee, Dong-Ho Lee, Eun-Chul Ahn | 2011-03-29 |
| 7884875 | Camera module having lower connection portions defining a chip region and engaging upper connection portions of a lens structure and method of fabricating the same | Dong-Ho Lee | 2011-02-08 |
| 7825468 | Semiconductor packages, stacked semiconductor packages, and methods of manufacturing the semiconductor packages and the stacked semiconductor packages | Dong-Ho Lee | 2010-11-02 |
| 7777345 | Semiconductor device having through electrode and method of fabricating the same | Ho-Jin Lee, Nam-Seog Kim, Hyun-Soo Chung, In-Young Lee, Son-Kwan Hwang | 2010-08-17 |
| 7777323 | Semiconductor structure and method for forming the same | Keum-Hee Ma, Kang-Wook Lee, Dong-Ho Lee, Seong-Il Han | 2010-08-17 |
| 7732328 | Method of fabricating semiconductor package structure | Dong-Ho Lee | 2010-06-08 |
| 7602047 | Semiconductor device having through vias | Dong-Ho Lee, In-Young Lee | 2009-10-13 |
| 7588964 | Methods of stacking semiconductor devices and methods of fabricating semiconductor device packages using the same | Dong-Ho Lee, Myung-Kee Chung, Kang-Wook Lee, Sun-Won Kang, Keum-Hee Ma | 2009-09-15 |
| 7534656 | Image sensor device and method of manufacturing the same | Kang-Wook Lee, Gu-Sung Kim, Seong-Il Han, Keum-Hee Ma, Suk-Chae Kang +1 more | 2009-05-19 |
| 7521657 | Assembly having wafer with image sensor chips, a photo-sensitive adhesive pattern and plate thereof and method of manufacturing the same | Kang-Wook Lee, Gu-Sung Kim, Keum-Hee Ma, Seong-Il Han | 2009-04-21 |
| 7459774 | Stacked chip package using photosensitive polymer and manufacturing method thereof | Kang-Wook Lee, Keum-Hee Ma, Seong-II Han | 2008-12-02 |
| 7371614 | Image sensor device and methods thereof | Suk-Chae Kang, Kang-Wook Lee, Gu-Sung Kim, Jong Woo Kim, Seong-Il Han +3 more | 2008-05-13 |
| 7262475 | Image sensor device and method of manufacturing same | Kang-Wook Lee, Gu-Sung Kim, Seong-Il Han, Keum-Hee Ma, Suk-Chae Kang +1 more | 2007-08-28 |