SH

Seong-II Han

Samsung: 1 patents #49,284 of 75,807Top 70%
Overall (All Time): #3,371,695 of 4,157,543Top 85%
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Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
7459774 Stacked chip package using photosensitive polymer and manufacturing method thereof Yong-Chai Kwon, Kang-Wook Lee, Keum-Hee Ma 2008-12-02