Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7459774 | Stacked chip package using photosensitive polymer and manufacturing method thereof | Yong-Chai Kwon, Kang-Wook Lee, Keum-Hee Ma | 2008-12-02 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7459774 | Stacked chip package using photosensitive polymer and manufacturing method thereof | Yong-Chai Kwon, Kang-Wook Lee, Keum-Hee Ma | 2008-12-02 |