| 9685400 |
Semiconductor package and method of forming the same |
Tae-Joo Hwang, Tae-Gyeong Chung |
2017-06-20 |
| 9484292 |
Semiconductor package and method of forming the same |
Tae-Joo Hwang, Tae-Gyeong Chung |
2016-11-01 |
| 9449918 |
Semiconductor device having fuse pattern |
Moon Gi Cho, Sang-Young Kim, Joo-Weon Shin, Min Ho Lee |
2016-09-20 |
| 9123725 |
Semiconductor device having fuse pattern |
Moon Gi Cho, Sang-Young Kim, Joo-Weon Shin, Min Ho Lee |
2015-09-01 |
| 8922012 |
Integrated circuit chip and flip chip package having the integrated circuit chip |
Jin-Woo Park, Dong-Kil Shin, Sun-Won Kang, Jong Ho Lee |
2014-12-30 |
| 8735281 |
Inter connection structure including copper pad and pad barrier layer, semiconductor device and electronic apparatus including the same |
Chang-Woo Shin, Hyun-Soo Chung, Jum-Gon Kim, Jin-ho Chun |
2014-05-27 |
| 8736035 |
Semiconductor package and method of forming the same |
Tae-Joo Hwang, Tae-Gyeong Chung |
2014-05-27 |
| 8456012 |
Inter connection structure including copper pad and pad barrier layer, semiconductor device and electronic apparatus including the same |
Chang-Woo Shin, Hyun-Soo Chung, Jum-Gon Kim, Jin-ho Chun |
2013-06-04 |
| 8421244 |
Semiconductor package and method of forming the same |
Tae-Joo Hwang, Tae-Gyeong Chung |
2013-04-16 |
| 8367472 |
Method of fabricating a 3-D device |
Jong Ho Lee, Dong-Ho Lee, Yong-Chai Kwon |
2013-02-05 |
| 8354744 |
Stacked semiconductor package having reduced height |
Byung Woo Lee, Young Lyong Kim |
2013-01-15 |
| 8344497 |
Semiconductor package and electronic device having the same |
Pyoung-Wan Kim, Teak-Hoon Lee, Chul-Yong Jang |
2013-01-01 |
| 8129221 |
Semiconductor package and method of forming the same |
Tae-Joo Hwang, Tae-Gyeong Chung |
2012-03-06 |
| 8022555 |
Semiconductor package and method of forming the same |
Tae-Joo Hwang, Tae-Gyeong Chung |
2011-09-20 |
| 8008771 |
Semiconductor chip package, electronic device including the semiconductor chip package and methods of fabricating the electronic device |
Pyoung-Wan Kim, Jong Ho Lee, Teak-Hoon Lee, Chul-Yong Jang |
2011-08-30 |
| 7923291 |
Method of fabricating electronic device having stacked chips |
Hae-Jung Yu, Tae-Gyeong Chung, Nam-Seog Kim |
2011-04-12 |
| 7915710 |
Method of fabricating a semiconductor device, and semiconductor device with a conductive member extending through a substrate and connected to a metal pattern bonded to the substrate |
Jong Ho Lee, Dong-Ho Lee, Yong-Chai Kwon |
2011-03-29 |
| 7898075 |
Semiconductor package having resin substrate with recess and method of fabricating the same |
Chul-Yong Jang, Pyoung-Wan Kim, Taek-Hoon Lee |
2011-03-01 |
| 7888785 |
Semiconductor package embedded in substrate, system including the same and associated methods |
Min-Ho O, Jong Ho Lee |
2011-02-15 |
| 7821139 |
Flip-chip assembly and method of manufacturing the same |
Tae-Joo Hwang, Tae-Gyeong Chung |
2010-10-26 |
| 7626254 |
Semiconductor package using chip-embedded interposer substrate |
Min-Ho O, Jong Ho Lee, Pyoung-Wan Kim |
2009-12-01 |
| 6857470 |
Stacked chip package with heat transfer wires |
Hee Jin Park, Tae-Gyeong Chung |
2005-02-22 |
| 6381838 |
BGA package and method of manufacturing the same |
Woong Ky Ha, Young-Min Lee |
2002-05-07 |
