Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9685400 | Semiconductor package and method of forming the same | Tae-Joo Hwang, Tae-Gyeong Chung | 2017-06-20 |
| 9484292 | Semiconductor package and method of forming the same | Tae-Joo Hwang, Tae-Gyeong Chung | 2016-11-01 |
| 9449918 | Semiconductor device having fuse pattern | Moon Gi Cho, Sang-Young Kim, Joo-Weon Shin, Min Ho Lee | 2016-09-20 |
| 9123725 | Semiconductor device having fuse pattern | Moon Gi Cho, Sang-Young Kim, Joo-Weon Shin, Min Ho Lee | 2015-09-01 |
| 8922012 | Integrated circuit chip and flip chip package having the integrated circuit chip | Jin-Woo Park, Dong-Kil Shin, Sun-Won Kang, Jong Ho Lee | 2014-12-30 |
| 8735281 | Inter connection structure including copper pad and pad barrier layer, semiconductor device and electronic apparatus including the same | Chang-Woo Shin, Hyun-Soo Chung, Jum-Gon Kim, Jin-ho Chun | 2014-05-27 |
| 8736035 | Semiconductor package and method of forming the same | Tae-Joo Hwang, Tae-Gyeong Chung | 2014-05-27 |
| 8456012 | Inter connection structure including copper pad and pad barrier layer, semiconductor device and electronic apparatus including the same | Chang-Woo Shin, Hyun-Soo Chung, Jum-Gon Kim, Jin-ho Chun | 2013-06-04 |
| 8421244 | Semiconductor package and method of forming the same | Tae-Joo Hwang, Tae-Gyeong Chung | 2013-04-16 |
| 8367472 | Method of fabricating a 3-D device | Jong Ho Lee, Dong-Ho Lee, Yong-Chai Kwon | 2013-02-05 |
| 8354744 | Stacked semiconductor package having reduced height | Byung Woo Lee, Young Lyong Kim | 2013-01-15 |
| 8344497 | Semiconductor package and electronic device having the same | Pyoung-Wan Kim, Teak-Hoon Lee, Chul-Yong Jang | 2013-01-01 |
| 8129221 | Semiconductor package and method of forming the same | Tae-Joo Hwang, Tae-Gyeong Chung | 2012-03-06 |
| 8022555 | Semiconductor package and method of forming the same | Tae-Joo Hwang, Tae-Gyeong Chung | 2011-09-20 |
| 8008771 | Semiconductor chip package, electronic device including the semiconductor chip package and methods of fabricating the electronic device | Pyoung-Wan Kim, Jong Ho Lee, Teak-Hoon Lee, Chul-Yong Jang | 2011-08-30 |
| 7923291 | Method of fabricating electronic device having stacked chips | Hae-Jung Yu, Tae-Gyeong Chung, Nam-Seog Kim | 2011-04-12 |
| 7915710 | Method of fabricating a semiconductor device, and semiconductor device with a conductive member extending through a substrate and connected to a metal pattern bonded to the substrate | Jong Ho Lee, Dong-Ho Lee, Yong-Chai Kwon | 2011-03-29 |
| 7898075 | Semiconductor package having resin substrate with recess and method of fabricating the same | Chul-Yong Jang, Pyoung-Wan Kim, Taek-Hoon Lee | 2011-03-01 |
| 7888785 | Semiconductor package embedded in substrate, system including the same and associated methods | Min-Ho O, Jong Ho Lee | 2011-02-15 |
| 7821139 | Flip-chip assembly and method of manufacturing the same | Tae-Joo Hwang, Tae-Gyeong Chung | 2010-10-26 |
| 7626254 | Semiconductor package using chip-embedded interposer substrate | Min-Ho O, Jong Ho Lee, Pyoung-Wan Kim | 2009-12-01 |
| 6857470 | Stacked chip package with heat transfer wires | Hee Jin Park, Tae-Gyeong Chung | 2005-02-22 |
| 6381838 | BGA package and method of manufacturing the same | Woong Ky Ha, Young-Min Lee | 2002-05-07 |