HP

Hee Jin Park

Samsung: 16 patents #8,525 of 75,807Top 15%
PF Postech Academy-Industry Foundation: 2 patents #241 of 1,477Top 20%
MS Magnachip Semiconductor: 2 patents #141 of 404Top 35%
II Inha-Industry Partnership Institute: 1 patents #75 of 351Top 25%
LT Lg Telecom: 1 patents #2 of 6Top 35%
LU Lg Uplus: 1 patents #7 of 27Top 30%
DC Daedong Industrial Co.: 1 patents #10 of 29Top 35%
SH Sk Hynix: 1 patents #3,115 of 4,849Top 65%
SF Snu R&Db Foundation: 1 patents #423 of 1,470Top 30%
LG: 1 patents #17,402 of 26,165Top 70%
LP Line Plus: 1 patents #76 of 147Top 55%
DT Daegu Gyeongbuk Institute Of Science And Technology: 1 patents #140 of 480Top 30%
HE Hynix (Hyundai Electronics): 1 patents #731 of 1,604Top 50%
Overall (All Time): #144,499 of 4,157,543Top 4%
27
Patents All Time

Issued Patents All Time

Showing 25 most recent of 27 patents

Patent #TitleCo-InventorsDate
11800353 Locking apparatus and control method thereof Hyo Il LEE, Dong-Yeol Kim, Jong Soo Park, Seung Bae Lee 2023-10-24
11701446 Photocatalyst filter and air conditioner including the same Jee-Yeon Kim, Yong-Won Jeong, Jeong-Eun Lee, Jun-Ho Koh 2023-07-18
11706032 Method and apparatus for user authentication Kyu-Young Choi, Ji-Hoon Cho 2023-07-18
11609976 Method and system for managing image based on interworking face image and messenger account Yuri Jo 2023-03-21
11585546 Photocatalytic filter and air conditioning device comprising photocatalytic filter Jee-Yeon Kim, Yong-Won Jeong, Sae Mi Kim, Jeong-Eun Lee 2023-02-21
11576995 Method for manufacturing photocatalytic filter for air purification Jee-Yeon Kim, Wonyong Choi, Seunghyun Weon, Sae Mi Kim 2023-02-14
11496469 Apparatus and method for registering biometric information, apparatus and method for biometric authentication Hyun-Chul Park, Dong Yeong Kim, Kyung-Joon Park, Hyo Il LEE, Jae Hyuk Cho 2022-11-08
11452994 Method for producing photocatalyst and photocatalyst filter for air cleaning Wonyong Choi, Seunghyun Weon, Sungwon Kim, Jee-Yeon Kim 2022-09-27
11289345 Heat releasing semiconductor chip package and method for manufacturing the same Jo Han Kim, Kyeong Su Kim, Jae Jin Lee 2022-03-29
10722605 Photocatalyst filter and air conditioner including the same Jee-Yeon Kim, Yong-Won Jeong, Jeong-Eun Lee, Jun-Ho Koh 2020-07-28
10676850 Washing machine and method for controlling the same Soon-cheol Kweon, Young Uk Yun, Seung Eun Chung 2020-06-09
10400424 Joystick lever assembly Jin Mok Park, Ki Ho Park, Bo Gun Seo 2019-09-03
10340156 Heat releasing semiconductor chip package and method for manufacturing the same Jo Han Kim, Kyeong Su Kim, Jae Jin Lee 2019-07-02
10071917 Softening apparatus Chang Bae LIM, Wha Seung Ahn, Da Eun Kim, Moon Il Jung, In-Jo Jeong 2018-09-11
9878448 Omnidirectional moving robot device, and system and method for object conveyance using the same Tae Hun KANG, Jeon Il Moon 2018-01-30
9828260 Softening apparatus Moon Il Jung, Soon-cheol Kweon, Da Eun Kim, Chang Bae LIM, In-Jo Jeong 2017-11-28
9189105 Touch sensor Ji-hyuk Lim, Seung Mi Lee, Suk Jin Ham 2015-11-17
8321153 Method for determining isotopic clusters and monoisotopic masses of polypeptides on mass spectra of complex polypeptide mixtures and computer-readable medium thereof Kun Soo Park, Joo Young Yoon, Sun Ho Lee, Eun Ok Paek, Sang Won Lee 2012-11-27
8223248 Image sensor module having a semiconductor chip, a holder and a coupling member Seung Hyun Lee, Chan Ki Hwang, Seung Ho Lee 2012-07-17
7885870 System for providing banking services by use of mobile communication Deok-Young Nam, Hyung Seok Kim, Jun-Hyung Kim 2011-02-08
7629679 Semiconductor package, memory card including the same, and mold for fabricating the memory card 2009-12-08
7485959 Structure for joining a semiconductor package to a substrate using a solder column Cheol-Joon Yoo, Jin Ho Kim, Tae-Sung Yoon, Chan-Suk Lee 2009-02-03
7374079 Method for providing banking services by use of mobile communication system Deok-Young Nam, Hyung Seok Kim, Jun-Hyung Kim 2008-05-20
7368821 BGA semiconductor chip package and mounting structure thereof Sang-Young Kim, Jin Ho Kim, Young-Hee Song, Tae-Sung Yoon 2008-05-06
6857470 Stacked chip package with heat transfer wires Tae-Gyeong Chung, Eun-Chul Ahn 2005-02-22