Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7485959 | Structure for joining a semiconductor package to a substrate using a solder column | Cheol-Joon Yoo, Jin Ho Kim, Hee Jin Park, Tae-Sung Yoon | 2009-02-03 |
| 7414303 | Lead on chip semiconductor package | Sang-Hyeop Lee, Se-Yong Oh, Jin Ho Kim, Min-Keun Kwak, Sung Hwan Yoon +1 more | 2008-08-19 |
| 7199458 | Stacked offset semiconductor package and method for fabricating | — | 2007-04-03 |
| 6984877 | Bumped chip carrier package using lead frame and method for manufacturing the same | Cheul-Joong Youn | 2006-01-10 |