Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7939924 | Stack type ball grid array package and method for manufacturing the same | — | 2011-05-10 |
| 7485959 | Structure for joining a semiconductor package to a substrate using a solder column | Jin Ho Kim, Hee Jin Park, Tae-Sung Yoon, Chan-Suk Lee | 2009-02-03 |
| 7465142 | Method and apparatus for picking up a semiconductor chip, method and apparatus for removing a semiconductor chip from a dicing tape, and a method of forming a perforated dicing tape | — | 2008-12-16 |
| 7298033 | Stack type ball grid array package and method for manufacturing the same | — | 2007-11-20 |
| 7284941 | Method and apparatus for picking up a semiconductor chip, method and apparatus for removing a semiconductor chip from a dicing tape, and a method of forming a perforated dicing tape | — | 2007-10-23 |
| 7279360 | Semiconductor device and method of packaging the same | — | 2007-10-09 |
| 7170158 | Double-sided circuit board and multi-chip package including such a circuit board and method for manufacture | Hee-Kook Choi | 2007-01-30 |
| 7129118 | Protective tape removing apparatus and method of assembling semiconductor package using the same | Ki-Kwon Jeong | 2006-10-31 |
| 7129585 | Semiconductor device and method of packaging the same | — | 2006-10-31 |
| 6869264 | Method and apparatus for picking up a semiconductor chip, method and apparatus for removing a semiconductor chip from a dicing tape, and a method of forming a perforated dicing tape | — | 2005-03-22 |
| 6808379 | Cleaner for molding apparatus of semiconductor chip packages | — | 2004-10-26 |