Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8941245 | Semiconductor package including semiconductor chip with through opening | Chang-Cheol Lee, Hyun Jun Kim, In-Young Lee | 2015-01-27 |
| 8796597 | In-line package apparatuses and methods | Min-Ill Kim, Jong Gi LEE, Kwang-Yong Lee | 2014-08-05 |
| 8149404 | Method for aligning wafer and alignment apparatus using the method | Young-shin Choi | 2012-04-03 |
| 7494845 | Method of forming a thin wafer stack for a wafer level package | Hyeon Hwang | 2009-02-24 |
| 7479455 | Method for manufacturing semiconductor wafer | Hyeon Hwang | 2009-01-20 |
| 7294531 | Wafer level chip stack method | Hyeon Hwang, Dong-Kuk Kim | 2007-11-13 |
| 7262114 | Die attaching method of semiconductor chip using warpage prevention material | Hyeon Hwang | 2007-08-28 |
| 7129118 | Protective tape removing apparatus and method of assembling semiconductor package using the same | Cheol-Joon Yoo | 2006-10-31 |
| 7051428 | In line system used in a semiconductor package assembling | Dong-Kuk Kim | 2006-05-30 |
| 6923077 | Apparatus and method for wafer backside inspection | Dong-Kuk Kim, Seung-Bae Jeong | 2005-08-02 |
| 5898226 | Semiconductor chip having a bonding window smaller than a wire ball | Hyeong-Seob Kim | 1999-04-27 |