Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11862603 | Semiconductor packages with chips partially embedded in adhesive | Taewook Kim, Jongho Lee, Jeongjoon Oh | 2024-01-02 |
| 7494845 | Method of forming a thin wafer stack for a wafer level package | Ki-Kwon Jeong | 2009-02-24 |
| 7479455 | Method for manufacturing semiconductor wafer | Ki-Kwon Jeong | 2009-01-20 |
| 7294531 | Wafer level chip stack method | Dong-Kuk Kim, Ki-Kwon Jeong | 2007-11-13 |
| 7262114 | Die attaching method of semiconductor chip using warpage prevention material | Ki-Kwon Jeong | 2007-08-28 |