Issued Patents All Time
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7679928 | System-in-package module and mobile terminal having the same | Tae Hyun Kim, Sung Kwon, Tae Ha LEE | 2010-03-16 |
| 7453045 | Rigid-flexible PCB having coverlay made of liquid crystalline polymer and fabrication method thereof | Bum Young Myoung, Dek-Gin Yang | 2008-11-18 |
| 7374966 | Apparatus for stacking semiconductor chips, method for manufacturing semiconductor package using the same and semiconductor package manufactured thereby | Min-Ill Kim, Chang-Cheol Lee, Tae-Hoe Hwang, Jae-young Hong | 2008-05-20 |
| 7346982 | Method of fabricating printed circuit board having thin core layer | Chong-Ho Kim, Hyo Soo Lee, Young-Hwan Shin | 2008-03-25 |
| 7347950 | Rigid flexible printed circuit board and method of fabricating same | Bum-Young Myung, Young Po Park, Young Seok Yoon, Dek-Gin Yang | 2008-03-25 |
| 7298032 | Semiconductor multi-chip package and fabrication method | Chang-Cheol Lee | 2007-11-20 |
| 7294531 | Wafer level chip stack method | Hyeon Hwang, Ki-Kwon Jeong | 2007-11-13 |
| 7135353 | Apparatus for stacking semiconductor chips, method for manufacturing semiconductor package using the same and semiconductor package manufactured thereby | Min-Ill Kim, Chang-Cheol Lee, Tae-Hoe Hwang, Jae-young Hong | 2006-11-14 |
| 7096914 | Apparatus for bonding a chip using an insulating adhesive tape | Min-Il Kim, Sang-Yeop Lee, Chang-Cheol Lee | 2006-08-29 |
| 7082679 | Rigid-flexible PCB having coverlay made of liquid crystalline polymer and fabrication method thereof | Bum Young Myoung, Dek-Gin Yang | 2006-08-01 |
| 7051428 | In line system used in a semiconductor package assembling | Ki-Kwon Jeong | 2006-05-30 |
| 6923077 | Apparatus and method for wafer backside inspection | Seung-Bae Jeong, Ki-Kwon Jeong | 2005-08-02 |
| 6742561 | Apparatus for die bonding | Shi-baek Nam | 2004-06-01 |
| 6662799 | Vertical wafer sawing apparatus | Seung-Chul Ahn | 2003-12-16 |
| 6620028 | Apparatus for cutting a wafer | Sun-Mo Yang | 2003-09-16 |
| 5936757 | Thin film actuated mirror array | Jeong-Beom Ji, Seok-Won Lee | 1999-08-10 |
| 5900998 | Thin film actuated mirror array and method for the manufacture thereof | Jeong-Beom Ji, Seok-Won Lee | 1999-05-04 |
| 5841569 | Method of manufacturing an array of thin film actuated mirrors | — | 1998-11-24 |
| 5758396 | Method of manufacturing a piezoelectric actuator array | Yong-Bae Jeon | 1998-06-02 |
| 5760947 | Thin film actuated mirror array for use in an optical projection system and method for the manufacture thereof | Jeong-Beom Ji, Yong-Ki Min | 1998-06-02 |
| 5661611 | Thin film actuated mirror array and method for the manufacture thereof | Jeong-Beom Ji, Seok-Won Lee | 1997-08-26 |
| 5636070 | Thin film actuated mirror array | Jeong-Beom Ji | 1997-06-03 |
| 5608569 | Method for manufacturing an array of thin film actuated mirrors | — | 1997-03-04 |
| 5606451 | Electrodisplacive actuator array and method for the manufacture thereof | Yong K. Kim | 1997-02-25 |
| 5505807 | Actuated mirror array and method for the fabricating thereof | Yong-Ki Min | 1996-04-09 |